參數(shù)資料
型號: MCC3E0RX180WB0B
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 180 MHz, RISC PROCESSOR, CBGA728
封裝: 29 X 29 MM, 4 MM HEIGHT, 1 MM PITCH, CERAMIC, FCBGA-728
文件頁數(shù): 95/120頁
文件大小: 1633K
代理商: MCC3E0RX180WB0B
76
CHAPTER 3: ELECTRICAL SPECIFICATIONS
C3ENPA1-DS/D REV 03
MOTOROLA GENERAL BUSINESS INFORMATION
large mass of the heat sink, attachment through the printed circuit board is suggested. If a
spring clip is used, the spring force should not exceed 5.5 pounds.
Figure 10 Package Cross Section View with Serveral Heat Sink Options
Internal Package Conduction Resistance
For the exposed-die packaging technology the intrinsic conduction thermal resistance
paths are as follows:
The die junction-to-case (or top-of-die for exposed silicon) thermal resistance
The die junction-to-ball thermal resistance
Figure 11 depicts the primary heat transfer path for a package with an attached heat sink
mounted to a printed-circuit board.
CBGA Package
Heat Sink
Heat Sink Clip
Thermal Interface Material
Printed Circuit Board
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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