- 您現(xiàn)在的位置：買賣IC網 > PDF目錄4042 > MC7410VU500LE (Freescale Semiconductor)IC MPU RISC 32BIT 360-FCCBGA PDF資料下載
參數(shù)資料
| 型號： | MC7410VU500LE |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 42/56頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MPU RISC 32BIT 360-FCCBGA |
| 標準包裝： | 44 |
| 系列： | MPC74xx |
| 處理器類型： | 32-位 MPC74xx PowerPC |
| 速度： | 500MHz |
| 電壓： | 1.8V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 360-BCBGA，F(xiàn)CCBGA |
| 供應商設備封裝： | 360-FCCBGA（25x25） |
| 包裝： | 托盤 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁當前第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁
MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1
Freescale Semiconductor
47
System Design Information
Figure 30. Thermalloy #2328B Heat Sink-to-Ambient Thermal Resistance Versus Airflow Velocity
Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common figure-of-merit
used for comparing the thermal performance of various microelectronic packaging technologies, one should
exercise caution when only using this metric in determining thermal management because no single parameter can
adequately describe three-dimensional heat flow. The final die-junction operating temperature, is not only a function
of the component-level thermal resistance, but the system-level design and its operating conditions. In addition to
the component's power consumption, a number of factors affect the final operating die-junction
temperature—airflow, board population (local heat flux of adjacent components), heat sink efficiency, heat sink
attach, heat sink placement, next-level interconnect technology, system air temperature rise, altitude, and so on.
Due to the complexity and the many variations of system-level boundary conditions for today's microelectronic
equipment, the combined effects of the heat transfer mechanisms (radiation, convection, and conduction) may vary
widely. For these reasons, we recommend using conjugate heat transfer models for the board, as well as,
system-level designs.
1
3
5
7
8
00.5
11.5
22.5
3
3.5
Thermalloy #2328B Pin-Fin Heat Sink
Approach Air Velocity (m/s)
Heat
Si
nk
Ther
m
a
lRes
is
tan
ce
(
C/
W
)
(25
× 28 × 15 mm)
2
4
6
相關PDF資料 |
PDF描述 |
|---|---|
| ACB108DHAN | CONN EDGECARD 216PS R/A .050 DIP |
| IDT70V9369L9PF8 | IC SRAM 288KBIT 9NS 100TQFP |
| MPC7410VS500LE | IC MPU PPC 500MHZ 360-FCCLGA |
| MPC8567VTAUJJ | MPU POWERQUICC III 1023-PBGA |
| IDT70V9179L9PF8 | IC SRAM 288KBIT 9NS 100TQFP |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MC7411MEL | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| MC7412 | 制造商:SHENZHENFREESCALE 制造商全稱:ShenZhen FreesCale Electronics. Co., Ltd 功能描述:N-Channel 20V (D-S) MOSFET High performance trench technology |
| MC7413 | 制造商:SHENZHENFREESCALE 制造商全稱:ShenZhen FreesCale Electronics. Co., Ltd 功能描述:P-Channel 20-V (D-S) MOSFET High performance trench technology |
| MC7415 | 制造商:SHENZHENFREESCALE 制造商全稱:ShenZhen FreesCale Electronics. Co., Ltd 功能描述:P-Channel 20-V (D-S) MOSFET High performance trench technology |
| MC74195L | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
發(fā)布緊急采購，3分鐘左右您將得到回復。