參數(shù)資料
型號： MC7410VU500LE
廠商： Freescale Semiconductor
文件頁數(shù)： 2/56頁
文件大?。?/td> 0K
描述： IC MPU RISC 32BIT 360-FCCBGA
標準包裝： 44
系列： MPC74xx
處理器類型： 32-位 MPC74xx PowerPC
速度： 500MHz
電壓： 1.8V
安裝類型： 表面貼裝
封裝/外殼： 360-BCBGA，F(xiàn)CCBGA
供應商設備封裝： 360-FCCBGA（25x25）
包裝： 托盤
MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1
10
Freescale Semiconductor
Electrical and Thermal Characteristics
Table 4 provides the package thermal characteristics for the MPC7410.
Table 3. Recommended Operating Conditions 1
Characteristic
Symbol
Recommended
Value
Unit
Notes
Core supply voltage
VDD
1.8 V ± 100 mV
V
—
PLL supply voltage
AVDD
1.8 V ± 100 mV
V
—
L2 DLL supply voltage
L2AVDD
1.8 V ± 100 mV
V
—
Processor bus supply
voltage
BVSEL = 0
OVDD
1.8 V ± 100 mV
V
—
BVSEL = HRESET
OVDD
2.5 V ± 100 mV
V
—
BVSEL = HRESET or
BVSEL = 1
OVDD
3.3 V ± 165 mV
V
2, 3
L2 bus supply voltage
L2VSEL = 0
L2OVDD
1.8 V ± 100 mV
V
—
L2VSEL = HRESET or
L2VSEL = 1
L2OVDD
2.5 V ± 100 mV
V
—
Input voltage
Processor bus and
JTAG signals
Vin
GND to OVDD
V—
L2 bus
Vin
GND to L2OVDD
V—
Die-junction temperature
Tj
0 to 105
°C
—
Notes:
1. These are the recommended and tested operating conditions. Proper device operation outside of these conditions
is not guaranteed.
2. M
xx7410xxnnnLE (Rev. 1.4) and later only. Previous revisions do not support 3.3 V OVDD and have a
recommended OVDD value of 2.5 V ± 100 mV for BVSEL = 1.
3. M
xx7410xxnnnLE (Rev. 1.4) and later only. Previous revisions do not support BVSEL = HRESET.
Table 4. Package Thermal Characteristics
Characteristic
Symbol
Value
Unit
Notes
MPC7410
CBGA
MPC7410
HCTE
Junction-to-ambient thermal resistance, natural convection,
four-layer (2s2p) board
RθJMA
18
20
°C/W
1, 2
Junction-to-ambient thermal resistance, 1m/sec airflow,
four-layer (2s2p) board
RθJMA
14
16
°C/W
1, 2
Junction-to-ambient thermal resistance, 2m/sec airflow,
four-layer (2s2p) board
RθJMA
13
15
°C/W
1, 2
Junction-to-board thermal resistance
RθJB
911
°C/W
3
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