參數(shù)資料
型號： MC56F8355MFGE
廠商： Freescale Semiconductor
文件頁數(shù)： 72/172頁
文件大?。?/td> 0K
描述： IC DSP 16BIT 60MHZ 128-LQFP
標準包裝： 72
系列： 56F8xxx
核心處理器： 56800E
芯體尺寸： 16-位
速度： 60MHz
連通性： CAN，EBI/EMI，SCI，SPI
外圍設備： POR，PWM，溫度傳感器，WDT
輸入/輸出數(shù)： 49
程序存儲器容量： 264KB（132K x 16）
程序存儲器類型： 閃存
RAM 容量： 10K x 16
電壓 - 電源 (Vcc/Vdd)： 2.25 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 16x12b
振蕩器型： 外部
工作溫度： -40°C ~ 125°C
封裝/外殼： 128-LQFP
包裝： 托盤
配用： MC56F8367EVME-ND - EVAL BOARD FOR MC56F83X
Thermal Design Considerations
56F8355 Technical Data, Rev. 17
Freescale Semiconductor
163
Preliminary
Please see www.freescale.com for the most current case outline.
Part 12 Design Considerations
12.1 Thermal Design Considerations
An estimation of the chip junction temperature, TJ, can be obtained from the equation:
TJ = TA + (RθJΑ x PD)
where:
The junction-to-ambient thermal resistance is an industry-standard value that provides a quick and easy
estimation of thermal performance. Unfortunately, there are two values in common usage: the value
determined on a single-layer board and the value obtained on a board with two planes. For packages such
as the PBGA, these values can be different by a factor of two. Which value is closer to the application
depends on the power dissipated by other components on the board. The value obtained on a single-layer
board is appropriate for the tightly packed printed circuit board. The value obtained on the board with the
internal planes is usually appropriate if the board has low-power dissipation and the components are well
separated.
When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case thermal
resistance and a case-to-ambient thermal resistance:
RθJΑ = RθJC + RθCΑ
where:
RθJC is device-related and cannot be influenced by the user. The user controls the thermal environment to
change the case-to-ambient thermal resistance, RθCA . For instance, the user can change the size of the heat
sink, the air flow around the device, the interface material, the mounting arrangement on printed circuit
board, or change the thermal dissipation on the printed circuit board surrounding the device.
To determine the junction temperature of the device in the application when heat sinks are not used, the
Thermal Characterization Parameter (
Ψ
JT) can be used to determine the junction temperature with a
measurement of the temperature at the top center of the package case using the following equation:
TJ = TT + (ΨJT x PD)
where:
TA
= Ambient temperature for the package (oC)
RθJΑ = Junction-to-ambient thermal resistance (
oC/W)
PD
= Power dissipation in the package (W)
RθJA = Package junction-to-ambient thermal resistance °C/W
RθJC = Package junction-to-case thermal resistance °C/W
RθCA = Package case-to-ambient thermal resistance °C/W
TT
= Thermocouple temperature on top of package (oC)
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相關代理商/技術參數(shù)
參數(shù)描述
MC56F8355VFG60 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:16-bit Hybrid Controllers
MC56F8355VFGE 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC 16 BIT HYBRID CNTRLR RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT
MC56F8356 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:56F8356 16-bit Hybrid Controller
MC56F8356MFV60 制造商:Rochester Electronics LLC 功能描述:- Bulk
MC56F8356MFVE 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC 16 BIT HYBRID CONTROLLER RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT
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