FUNCTIONAL INTERNAL BLOCK DESCRIPTION HS1 VBAT S" />
參數(shù)資料
型號: MC33889BDW
廠商: Freescale Semiconductor
文件頁數(shù): 19/59頁
文件大?。?/td> 0K
描述: IC SYSTEM BASE W/CAN 28-SOIC
標(biāo)準(zhǔn)包裝: 1
控制器類型: 系統(tǒng)基礎(chǔ)芯片
接口: CAN
電源電壓: 5.5 V ~ 18 V
電流 - 電源: 45mA
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 28-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 28-SOIC W
包裝: 管件
Analog Integrated Circuit Device Data
26
Freescale Semiconductor
33889
FUNCTIONAL DESCRIPTION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
HS1 VBAT SWITCH OUTPUT
HS1 output is a 2.0 ohm typical switch from the VSUP pin. It allows the supply of external switches and their associated pullup
or pull-down circuitry, for example, in conjunction with the wake-up input pins. Output current is limited to 200 mA and HS1 is
protected against short-circuit and has an over temperature shutdown (reported into the IOR register). The HS1 output is
controlled from the internal register and the SPI. It can be activated at regular intervals in sleep mode thanks to an internal timer.
It can also be permanently turned on in normal or stand-by modes to drive external loads, such as relays or supply peripheral
components. In case of inductive load drive, external clamp circuitry must be added.
SPI
The complete device control as well as the status report is done through an 8 bit SPI interface. Refer to the SPI paragraph.
CAN
The device incorporates a low speed fault tolerant CAN physical interface. The speed rate is up to 125 kBaud.
The state of the CAN interface is programmable through the SPI. Reference the CAN transceiver description on page 31.
PACKAGE AND THERMAL CONSIDERATION
The device is proposed in a standard surface mount SO28 package. In order to improve the thermal performances of the SO28
package, 8 pins are internally connected to the lead frame and are used for heat transfer to the printed circuit board.
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