參數(shù)資料
型號(hào)： MC33887
廠商： Motorola, Inc.
英文描述： 5.0 A H-Bridge with Load Current Feedback
中文描述： 5.0的H -橋的負(fù)載電流反饋
文件頁(yè)數(shù)： 7/28頁(yè)
文件大?。?/td> 485K
代理商： MC33887
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
33887
7
THERMAL RESISTANCE (AND PACKAGE DISSIPATION) RATINGS
(Note 8)
,
(Note 9)
,
(Note 10)
,
(Note 11)
Junction-to-Board (Bottom Exposed Pad Soldered to Board)
HSOP (6.0 W)
PQFN (4.0 W)
SOICW-EP (2.0 W)
R
θ
JB
~5.0
~4.3
~8.0
°
C/W
Junction-to-Ambient, Natural Convection, Single-Layer Board (1s)
(Note 12)
HSOP (6.0 W)
PQFN (4.0 W)
SOICW-EP (2.0 W)
R
θ
JA
~41
~TBD
~62
°
C/W
Junction-to-Ambient, Natural Convection, Four-Layer Board (2s2p)
(Note 13)
HSOP (6.0 W)
PQFN (4.0 W)
SOICW-EP (2.0 W)
R
θ
JMA
~30
~21.3
~TBD
°
C/W
Junction-to-Case (Exposed Pad)
(Note 14)
HSOP (6.0 W)
PQFN (4.0 W)
SOICW-EP (2.0 W)
R
θ
JC
~0.5
~0.9
~1.5
°
C/W
Notes
8.
9.
The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.
Exposed heatsink pad plus the power and ground terminals comprise the main heat conduction paths. The actual R
θ
JB
(junction-to-PC board)
values will vary depending on solder thickness and composition and copper trace thickness. Maximum current at maximum die temperature
represents ~16 W of conduction loss heating in the diagonal pair of output MOSFETs. Therefore, the R
θ
JC
-total must be less than 5.0 °C/W
for maximum load at 70°C ambient. Module thermal design must be planned accordingly.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface
of the board near the package.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Indicates the average thermal resistance between the die and the exposed pad surface as measured by the cold plate method (MIL SPEC-
883 Method 1012.1) with the cold plate temperature used for the case temperature.
10.
11.
12.
13.
14.
MAXIMUM RATINGS (continued)
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
相關(guān)PDF資料
PDF描述
MC33887DH 5.0 A H-Bridge with Load Current Feedback
MC33887DHR2 5.0 A H-Bridge with Load Current Feedback
MC33887DWB 5.0 A H-Bridge with Load Current Feedback
MC33887DWBR2 5.0 A H-Bridge with Load Current Feedback
MC33887PNB 5.0 A H-Bridge with Load Current Feedback
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MC33887APVW 功能描述:馬達(dá)/運(yùn)動(dòng)/點(diǎn)火控制器和驅(qū)動(dòng)器 H-BRIDGE W/LD CURNT FDBK RoHS:否 制造商:STMicroelectronics 產(chǎn)品:Stepper Motor Controllers / Drivers 類(lèi)型:2 Phase Stepper Motor Driver 工作電源電壓:8 V to 45 V 電源電流:0.5 mA 工作溫度:- 25 C to + 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HTSSOP-28 封裝:Tube
MC33887APVW-PB 制造商:Freescale Semiconductor 功能描述:
MC33887APVWR2 功能描述:馬達(dá)/運(yùn)動(dòng)/點(diǎn)火控制器和驅(qū)動(dòng)器 H-BRIDGE W/LD CURNT FDBK RoHS:否 制造商:STMicroelectronics 產(chǎn)品:Stepper Motor Controllers / Drivers 類(lèi)型:2 Phase Stepper Motor Driver 工作電源電壓:8 V to 45 V 電源電流:0.5 mA 工作溫度:- 25 C to + 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HTSSOP-28 封裝:Tube
MC33887AVW 功能描述:開(kāi)關(guān) IC - 各種 H-BRIDGE W/LD CURNT FDBK RoHS:否 制造商:Fairchild Semiconductor 開(kāi)啟電阻（最大值）: 電源電壓-最大:4.4 V 電源電壓-最小:2.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:WLCSP-9 封裝:Reel
MC33887AVWR2 功能描述:馬達(dá)/運(yùn)動(dòng)/點(diǎn)火控制器和驅(qū)動(dòng)器 H-BRIDGE W/LD CURNT FDBK RoHS:否 制造商:STMicroelectronics 產(chǎn)品:Stepper Motor Controllers / Drivers 類(lèi)型:2 Phase Stepper Motor Driver 工作電源電壓:8 V to 45 V 電源電流:0.5 mA 工作溫度:- 25 C to + 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HTSSOP-28 封裝:Tube
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