參數(shù)資料
型號: MC33887
廠商: Motorola, Inc.
英文描述: 5.0 A H-Bridge with Load Current Feedback
中文描述: 5.0的H -橋的負(fù)載電流反饋
文件頁數(shù): 20/28頁
文件大?。?/td> 485K
代理商: MC33887
33887
20
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
PERFORMANCE FEATURES
Short Circuit Protection
If an output short circuit condition is detected, the power
outputs tri-state (latch-OFF) independent of the input (IN1 and
IN2) states, and the fault status output flag is SET logic LOW. If
the D1 input changes from logic HIGH to logic LOW, or if the
D2
input changes from logic LOW to logic HIGH, the output bridge
will become operational again and the fault status flag will be
reset (cleared) to a logic HIGH state.
The output stage will always switch into the mode defined by
the input terminals (IN1, IN2, D1, and
D2
), provided the device
junction temperature is within the specified operating
temperature range.
Active Current Limiting
The maximum current flow under normal operating
conditions is internally limited to I
LIM
(5.2 A to 7.8 A). When the
maximum current value is reached, the output stages are tri-
stated for a fixed time (t
a
) of 20
μ
s typical. Depending on the
time constant associated with the load characteristics, the
current decreases during the tri-state duration until the next
output ON cycle occurs (see
Figures 7
and
13
, page 12 and
page 15, respectively).
The current limiting threshold value is dependent upon the
device junction temperature. When -40
°
C
T
J
160
°
C, I
LIM
is
between 5.2 A to 7.8 A. When T
J
exceeds 160
°
C, the
I
LIM
current decreases linearly down to 4.0 A typical at 175
°
C.
Above 175
°
C the device overtemperature circuit detects T
LIM
and overtemperature shutdown occurs (see
Figure 5
, page 11).
This feature allows the device to remain operational for a longer
time but at a regressing output performance level at junction
temperatures above 160
°
C.
Overtemperature Shutdown and Hysteresis
If an overtemperature condition occurs, the power outputs
are tri-stated (latched-OFF) and the fault status flag is SET to
logic LOW.
To reset from this condition, D1 must change from logic
HIGH to logic LOW, or
D2
must change from logic LOW to logic
HIGH. When reset, the output stage switches ON again,
provided that the junction temperature is now below the
overtemperature threshold limit minus the hysteresis.
Note
Resetting from the fault condition will clear the fault
status flag.
PACKAGE INFORMATION
The 33887 packages are designed for thermal performance.
The significant feature of these packages is the exposed pad on
which the power die is soldered. When soldered to a PCB, this
pad provides a path for heat flow to the ambient environment.
The more copper area and thickness on the PCB, the better the
power dissipation and transient behavior will be.
Example
Characterization on a double-sided PCB: bottom
side area of copper is 7.8 cm
2
; top surface is 2.7 cm
2
(see
Figure 19
); grid array of 24 vias 0.3 mm in diameter.
Figure 19. PCB Test Layout
Figure 20
shows the thermal response with the device in the
HSOP package soldered on to the test PCB described in
Figure 19
.
Figure 20. 33887 Thermal Response, HSOP Package
Top Side
Bottom Side
0,1
0,001
1
10
100
0,01
0,1
1
10
100
1000
10000
t, Time (s)
Rth (°C/W)
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
相關(guān)PDF資料
PDF描述
MC33887DH 5.0 A H-Bridge with Load Current Feedback
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MC33887APVW-PB 制造商:Freescale Semiconductor 功能描述:
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