參數(shù)資料
型號(hào): MAX9702ETI+T
廠商: Maxim Integrated Products
文件頁數(shù): 5/31頁
文件大?。?/td> 0K
描述: IC AMP AUDIO PWR 1.8W D 28TQFN
標(biāo)準(zhǔn)包裝: 2,500
系列: DirectDrive®
類型: D 類
輸出類型: 2-通道(立體聲)帶立體聲耳機(jī)
在某負(fù)載時(shí)最大輸出功率 x 通道數(shù)量: 1.8W x 2 @ 4 歐姆; 45mW x 2 @ 32 歐姆
電源電壓: 2.5 V ~ 5.5 V
特點(diǎn): 消除爆音,差分輸入,I²C,靜音,短路和熱保護(hù),關(guān)機(jī)
安裝類型: 表面貼裝
供應(yīng)商設(shè)備封裝: 28-TQFN-EP(5x5)
封裝/外殼: 28-WFQFN 裸露焊盤
包裝: 帶卷 (TR)
MAX9702
1.8W, Filterless, Stereo, Class D Audio Power
Amplifier and DirectDrive Stereo Headphone Amplifier
______________________________________________________________________________________
13
Pin Description
PIN
NAME
FUNCTION
1, 22
PVDD
H-Bridge Power Supply. Connect to VDD and bypass each PVDD with a 0.1F capacitor to
PGND.
2
SYNC_OUT
Clock Signal Output. Float SYNC_OUT if not used.
3
SCL
I2C Serial Clock. Connect a pullup resistor to VDD (see I2C Interface section).
4
SDA
I2C Serial Data. Connect a pullup resistor to VDD (see I2C Interface section).
5
BIAS
Common-Mode Voltage. Bypass to GND with a 1F capacitor.
6
SYNC
Frequency Mode Select:
SYNC = GND: Fixed-frequency mode with fS = 1100kHz.
SYNC = Float: Fixed-frequency mode with fS = 1340kHz.
SYNC = VDD: Spread-spectrum mode with fS = 1150kHz ±50kHz.
SYNC = Clocked: Fixed-frequency mode with fS = external clock frequency.
7
CPVDD
Charge-Pump Power Supply. Connect to VDD and bypass to CPGND with a 1F capacitor.
8
C1P
Charge-Pump Flying-Capacitor Positive Terminal. Connect a 1F capacitor from C1P to C1N.
9
CPGND
Charge-Pump Power Ground. Connect to PGND.
10
C1N
Charge-Pump Flying-Capacitor Negative Terminal. Connect a 1F capacitor from C1N to
C1P.
11
CPVSS
Charge-Pump Negative Output. Bypass with a 1F capacitor to CPGND.
12
VSS
Headphone Amplifier Negative Supply. Connect to CPVSS.
13
HPL
Left-Channel Headphone Output
14
HPR
Right-Channel Headphone Output
15
VDD
Analog Power Supply. Bypass with a 1F capacitor to GND.
16
GND
Analog Ground. Connect to PGND.
17
INR
Right-Channel Audio Input
18
INL
Left-Channel Audio Input
19
INM
Mono Audio Input
20
HPS
Headphone Sense:
HPS = VDD: Headphone mode.
HPS = GND: Speaker mode.
21
SHDN
Active-Low Shutdown. Connect to VDD for normal operation.
23
OUTR+
Right-Channel Positive Amplifier Output
24
OUTR-
Right-Channel Negative Amplifier Output
25, 26
PGND
Power Ground. Connect to GND.
27
OUTL-
Left-Channel Negative Amplifier Output
28
OUTL+
Left-Channel Positive Amplifier Output
EP
Exposed Pad. The external pad lowers the package’s thermal impedance by providing a
direct heat conduction path from the die to the printed circuit board. The exposed pad is
internally connected to VSS. Connect the exposed thermal pad to an isolated plane if
possible or to VSS.
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