參數(shù)資料
型號： MAX5725AAUP+T
廠商： Maxim Integrated Products
文件頁數(shù)： 12/35頁
文件大?。?/td> 0K
描述： IC DAC 12BIT SRL 20TSSOP
標準包裝： 2,500
設置時間： 4.5µs
位數(shù)： 12
數(shù)據(jù)接口： DSP，MICROWIRE?，QSPI?，串行，SPI?
轉(zhuǎn)換器數(shù)目： 1
電壓電源： 模擬和數(shù)字
功率耗散（最大）： 1.08W
工作溫度： -40°C ~ 125°C
安裝類型： 表面貼裝
封裝/外殼： 20-TSSOP（0.173"，4.40mm 寬）
供應商設備封裝： 20-TSSOP
包裝： 帶卷 (TR)
輸出數(shù)目和類型： 8 電流，單極
MAX5723/MAX5724/MAX5725
Ultra-Small, Octal-Channel, 8-/10-/12-Bit Buffered
Output DACs with Internal Reference and SPI Interface
2
Maxim Integrated
VDD, VDDIO to GND ................................................-0.3V to +6V
OUT_, REF to GND....0.3V to the lower of (VDD + 0.3V) and +6V
SCLK, CSB, IRQ, M/Z, LDAC, CLR to GND...........-0.3V to +6V
DIN, DOUT to GND .....................................-0.3V to the lower of
(VDDIO + 0.3V) and +6V
Continuous Power Dissipation (TA = +70NC)
TSSOP (derate at 13.6mW/NC above 70NC)..............1084mW
WLP (derate at 21.3mW/NC above 70NC)..................1700mW
Maximum Continuous Current into Any Pin .................... Q50mA
Operating Temperature.................................... -40NC to +125NC
Storage Temperature ....................................... -65NC to +150NC
Lead Temperature (TSSOP only)(soldering, 10s)...........+300NC
Soldering Temperature (reflow) .................................... +260NC
TSSOP
Junction-to-Ambient Thermal Resistance (θJA) ......73.8NC/W
Junction-to-Case Thermal Resistance (θJC) ..............20NC/W
WLP
Junction-to-Ambient Thermal Resistance (θJA)
(Note 2) ...................................................................47NC/W
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Note 2: Visit www.maximintegrated.com/app-notes/index.mvp/id/1891 for information about the thermal performance of WLP packaging.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
ELECTRICAL CHARACTERISTICS
(VDD = 2.7V to 5.5V, VDDIO = 1.8V to 5.5V, VGND = 0V, CL = 200pF, RL = 2kI, TA = -40NC to +125NC, unless otherwise noted.)
(Note 3)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC PERFORMANCE (Note 4)
Resolution and Monotonicity
N
MAX5723
8
Bits
MAX5724
10
MAX5725
12
Integral Nonlinearity (Note 5)
INL
MAX5723
-0.25
Q
0.05
+0.25
LSB
MAX5724
-0.5
Q
0.2
+0.5
MAX5725
-1
Q
0.5
+1
Differential Nonlinearity (Note 5)
DNL
MAX5723
-0.25
Q
0.05
+0.25
LSB
MAX5724
-0.5
Q
0.1
+0.5
MAX5725
-1
Q
0.2
+1
Offset Error (Note 6)
OE
-5
Q
0.5
+5
mV
Offset Error Drift
Q
10
F
V/NC
Gain Error (Note 6)
GE
-1.0
Q
0.1
+1.0
%FS
Gain Temperature Coefficient
With respect to VREF
Q
3.0
ppm of
FS/NC
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