參數(shù)資料
型號: M59MR032C
廠商: 意法半導體
英文描述: 32 Mbit 2Mb x16, Mux I/O, Dual Bank, Burst 1.8V Supply Flash Memory
中文描述: 32兆位的2Mb x16插槽,復用的I / O,雙行,突發(fā)1.8V電源快閃記憶體
文件頁數(shù): 21/49頁
文件大?。?/td> 352K
代理商: M59MR032C
21/49
M59MR032C, M59MR032D
Table 18. Status Register Bits
(1)
Note: 1. Status Register bits do not consider BINV.
2. DQ7 and DQ2 require a valid address when reading status information.
Status
DQ7
(2)
DQ6
DQ5
DQ3
DQ2
(2)
In Progress
Program
DQ7
Toggle
0
N/A
1
Block Erase Timeout
0
Toggle
0
0
N/A
Block/Chip Erase
0
Toggle
0
1
N/A
Erase Suspend
Mode
Erase Suspended Block
1
1
0
N/A
Toggle
Non Erase Suspended Block
Automatic return to reading array data
Programming during Erase Suspend
DQ7
Toggle
0
N/A
1
Successfully/
Completed
Word Program
Automatic return to reading array data
Block/Chip Erase
Exceeded
Time Limit
Word Program
DQ7
Toggle
1
N/A
1
Block/Chip Erase
0
Toggle
1
1
Toggle is
failed, block is
addressed
Program in Suspend
DQ7
Toggle
1
N/A
1
POWER CONSUMPTION
Power-down
The memory provides Reset/Power-down control
input RP. The Power-down function can be acti-
vated only if the relevant Configuration Register bit
is set to ’1’. In this case, when the RP signal is
pulled at V
SS
the supply current drops to typically
I
CC2
(see Table 28), the memory is deselected and
the outputs are in high impedance.If RP is pulled
to V
SS
during a Program or Erase operation, this
operation is aborted in t
PLQ7V
and the memory
content is no longer valid (see Reset/Power-down
input description).
Power-up
The memory Command Interface is reset on Pow-
er-up to Read Array. Either E or W must be tied to
V
IH
during Power-up to allow maximum security
and the possibility to write a command on the first
rising edge of W. At Power-up the device is config-
ured as:
– page mode: (CR15 = 1)
– power-down disabled: (CR10 = 0)
– BINV disabled: (CR14 = 0)
and all blocks are protected and unlocked.
Supply Rails
Normal precautions must be taken for supply volt-
age decoupling; each device in a system should
have the V
DD
rails decoupled with a 0.1μF capac-
itor close to the V
DD
, V
DDQ
and V
SS
pins. The PCB
trace widths should be sufficient to carry the re-
quired V
DD
program and erase currents.
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