參數(shù)資料
型號: LPC2470
廠商: NXP Semiconductors N.V.
英文描述: Flashless 16-bit/32-bit micro; Ethernet, CAN, LCD, USB 2.0 device/host/OTG, external memory interface
中文描述: 毛邊16-bit/32-bit微,以太網(wǎng),CAN,液晶顯示器,USB 2.0設(shè)備/主機(jī)/ OTG功能,外部存儲器接口
文件頁數(shù): 48/72頁
文件大小: 365K
代理商: LPC2470
LPC2470_0
NXP B.V. 2007. All rights reserved.
Preliminary data sheet
Rev. 00.01 — 5 October 2007
48 of 72
NXP Semiconductors
LPC2470
Fast communication chip
8.
Limiting values
[1]
The following applies to the Limiting values:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated
maximum.
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to V
SS
unless
otherwise noted.
[2]
Including voltage on outputs in 3-state mode.
[3]
Not to exceed 4.6 V.
[4]
The peak current is limited to 25 times the corresponding maximum current.
[5]
Dependent on package type.
[6]
Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k
Ω
series resistor.
Table 6.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
Symbol
Parameter
V
DD(3V3)
supply voltage (3.3 V)
Limiting values
Conditions
core and external
rail
Min
3.0
Max
3.6
Unit
V
V
DD(DCDC)(3V3)
DC-to-DC converter supply voltage
(3.3 V)
V
DDA
analog 3.3 V pad supply voltage
V
i(VBAT)
input voltage on pin VBAT
V
i(VREF)
input voltage on pin VREF
V
IA
analog input voltage
3.0
3.6
V
0.5
0.5
0.5
0.5
+4.6
+4.6
+4.6
+5.1
V
V
V
V
for the RTC
on ADC related
pins
5 V tolerant I/O
pins; only valid
when the V
DD(3V3)
supply voltage is
present
other I/O pins
V
I
input voltage
[2]
0.5
+6.0
V
[2][3]
0.5
V
DD(3V3)
+
0.5
100
100
+150
1.5
V
I
DD
I
SS
T
stg
P
tot(pack)
supply current
ground current
storage temperature
total power dissipation (per package)
per supply pin
per ground pin
[4]
-
mA
mA
°
C
W
[4]
-
[5]
65
-
based on package
heat transfer, not
device power
consumption
human body
model; all pins
V
esd
electrostatic discharge voltage
[6]
2000
+2000
V
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