參數(shù)資料
型號: LPC2377FBD144
廠商: NXP SEMICONDUCTORS
元件分類: 微控制器/微處理器
英文描述: Single-chip 16-bit-32-bit microcontrollers; 512 kB flash with ISP-IAP, Ethernet, USB 2.0, CAN, and 10-bit ADC-DAC
中文描述: 32-BIT, FLASH, 25 MHz, RISC MICROCONTROLLER, PQFP144
封裝: 20 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT486-1, LQFP-144
文件頁數(shù): 64/68頁
文件大?。?/td> 1443K
代理商: LPC2377FBD144
LPC2377_78
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 5 — 17 June 2010
64 of 68
NXP Semiconductors
LPC2377/78
Single-chip 16-bit/32-bit microcontrollers
17. Revision history
Table 19.
Document ID
LPC2377_78 v.5
Modifications:
Revision history
Release date
20100617
Table 3 “Pin description”
: Added
Table note 9
for XTAL1 and XTAL2 pins.
Table 3 “Pin description”
: Added
Table note 10
for RTCX1 and RTCX2 pins.
Table 4 “Limiting values”
: Changed V
ESD
min/max to
2500/+2500.
Table 6 “Static characteristics”
: Removed R
pu
.
Table 6 “Static characteristics”
,
Table note 13
: Changed value from 18 to 33.
Table 6 “Static characteristics”
: Updated min, typical and max values for oscillator pins.
Table 6 “Static characteristics”
: Updated conditions and typical values for I
DD(DCDC)pd(3V3)
,
I
BATact
; added I
DD(DCDC)dpd(3V3)
and I
BAT
.
Added
Table 11 “Dynamic characteristics of flash”
.
Table 12 “Dynamic characteristics: Static external memory interface”
: Updated table.
Added
Table 14 “DAC electrical characteristics”
.
Section 7.2 “On-chip flash programming memory”
: Removed text regarding flash
endurance minimum specs.
Added
Section 7.25.4.4 “Deep power-down mode”
.
Section 7.26.2 “Brownout detection”
: Changed V
DD(3V3)
to V
DD(DCDC)(3V3)
.
Added
Section 9 “Thermal characteristics”
.
Added
Section 10.1 “Power-down mode”
.
Added
Section 10.2 “Deep power-down mode”
Added
Section 10.3 “Electrical pin characteristics”
Added
Section 14.2 “Crystal oscillator XTAL input and component selection”
.
Added
Section 14.3 “RTC 32 kHz oscillator component selection”
.
Added
Section 14.4 “XTAL and RTCX Printed Circuit Board (PCB) layout guidelines”
.
Added
Section 14.5 “Standard I/O pin configuration”
Added
Section 14.6 “Reset pin configuration”
Moved
Figure 12 “External clock timing (with an amplitude of at least V
i(RMS)
= 200 mV)”
to
below
Table 7 “Dynamic characteristics”
.
Updated
Figure 13 “External memory read access”
.
Updated
Figure 14 “External memory write access”
.
Updated
Figure 17 “ADC characteristics”
.
20081119
Product data sheet
20070927
Preliminary data sheet
Font in graphics updated.
20070501
Preliminary data sheet
Removed references to V
DD(1V8)
.
Removed Deep power-down mode chapter and related references.
20061206
Preliminary data sheet
Data sheet status
Product data sheet
Change notice
Supersedes
LPC2377_78_4
LPC2377_78_4
LPC2378_3
Modifications:
LPC2378_2
Modifications:
LPC2378_3
LPC2378_2
-
LPC2378_1
LPC2378_1
-
-
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