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參數(shù)資料
| 型號： | LM3655TLX |
| 廠商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分類： | 電源管理 |
| 英文描述： | 1-CHANNEL POWER SUPPLY SUPPORT CKT, BGA25 |
| 封裝： | 2.5 X 2.5 MM, MICRO SMD, 25 PIN |
| 文件頁數(shù)： | 13/21頁 |
| 文件大?。?/td> | 833K |
| 代理商： | LM3655TLX |
15.0 Electrical Characteristics (Continued)
Note 1: Absolute Maximum ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see electrical characteristics per each
section. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated
under the listed test conditions.
Note 2: With PCB copper enhancements. Board description: Substrate Material is FR-4. Overall Dimension (LxW) is 76.2 mm x 114.3 mm. Metalization Dimension
(LxW) is 60.7 mm x 60.6 mm. Thickness is 1.57 mm. 6 thermal vias of Pitch = 1.27 mm (via pitch)/0.5 mm pad pitch. Number of Cu layers = 4. Cu coverage (signal
layer-top/bottom) is 4%/40%. Cu thickness (signal layer-top/bottom)=2oz copper. Cu coverage (power/ground layer) = 100%. Cu thickness (power/ground layer)
= 1 oz.
Note 3: The human body model is a 100 pF capacitor discharged through a 1.5 k
resistor into each pin. The machine model is a 200 pF capacitor discharged
directly into each pin.
Note 4: Maximum voltage on any pin with exception to VDETECT pin. VDETECT pin is protected by R4A and R4B resistors in series.
Note 5: NORMAL operating range. The part is expected to operate within its specified parametric limits in the normal range, and maintain all electrical specifications
and full functionality when operated within these limits. The normal operating range is intended to apply to battery packs used under average to severe use
conditions.
Note 6: The VIN pin is protected against very high transient fault currents by activation of a shunt regulator. The internal voltage of the chip at the cell pin is limited
to VSHUNT, however the external voltage of the VIN pin can increase beyond VSHUNT due to current in the lead resistance and M5.
Note 7: One side of the input comparator being driven by a buffered bandgap sets all digital input thresholds level of 1.2V. As a result any logic level that is greater
than approximately 1.3V will be logic high, and any logic level that is less than approximately 1.1V will be logic low.
Note 8: Extended junction temperature range applies to the maximum die temperature during a transient thermal protection event. Outside of these thermal
transients, the IC should not be operated where the die temperature goes outside of the Junction Temperature Range defined in table 7.1.
Note 9: The Absolute Maximum power dissipation depends on the ambient temperature and can be calculated using the formula:
P= (T
J –TA)/
θ
JA.
where TJ is the junction temperature, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance. The 950 mW rating appearing under
Absolute Maximum Ratings results from substituting the Thermal Crowbar temperature, 100C, for TJ, 70C for TA, and 35C/W for θJA. More power can be
dissipated safely at ambient temperatures below 70C. Less power can be dissipated safely at ambient temperatures above 70C.
Note 10: Junction Temperature minimum is set equal to the Normal Operating Temperature Range, The IC can be stored down to 65C without damage to the IC.
LM3655
www.national.com
20
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