THERMAL ADDENDUM (REV 2.0) ADDITIONAL DOCUMENT" />
參數(shù)資料
型號(hào)： KIT33989DWEVB
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 64/72頁(yè)
文件大?。?/td> 0K
描述： KIT EVAL 33989DW HS SBC
標(biāo)準(zhǔn)包裝： 1
主要目的： 接口，CAN 控制器
嵌入式： 是，MCU，8 位
已用 IC / 零件： MC33989
主要屬性： CAN 2.0 系統(tǒng)基礎(chǔ)芯片（SBC），SPI 接口，2 低壓降穩(wěn)壓器
次要屬性： 故障檢測(cè)，睡眠和待機(jī)模式
已供物品： 板，CD
相關(guān)產(chǎn)品： MC33989DWR2CT-ND - IC SYSTEM BASE W/CAN 28-SOIC
MC33989DWR2TR-ND - IC SYSTEM BASE W/CAN 28-SOIC
MC33989DW-ND - IC SYSTEM BASE W/CAN 28-SOIC
Analog Integrated Circuit Device Data
Freescale Semiconductor
67
33989
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
INTRODUCTION
This thermal addendum is provided as a supplement to the MC33989 technical
datasheet. The addendum provides thermal performance information that may be
critical in the design and development of system applications. All electrical,
application, and packaging information is provided in the data sheet.
Packaging and Thermal Considerations
The MC33989 is offered in a 28 pin SOICW, single die package. There is a
single heat source (P), a single junction temperature (TJ), and thermal resistance
(RJA).
The stated values are solely for a thermal performance comparison of one
package to another in a standardized environment. This methodology is not
meant to and will not predict the performance of a package in an application-
specific environment. Stated values were obtained by measurement and
simulation according to the standards listed below.
Standards
Table 37. Thermal Performance Comparison
Thermal Resistance
[
C/W]
RJA
41
RJB
10
RJA
68
RJC
220
Notes:
1.
Per JEDEC JESD51-2 at natural convection, still air
condition.
2.
2s2p thermal test board per JEDEC JESD51-7.
3.
Per JEDEC JESD51-8, with the board temperature on the
center trace near the center lead.
4.
Single layer thermal test board per JEDEC JESD51-3.
5.
Thermal resistance between the die junction and the
package top surface; cold plate attached to the package top
surface and remaining surfaces insulated.
28-PIN
SOICW
33989SOIC
EG SUFFIX (PB-FREE)
98ASB42345B
28-PIN SOICW
Note For package dimensions, refer to
98ASB42345B.
TJ
=
RJA
.
P
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