THERMAL ADDENDUM (REV 2.0) ADDITIONAL DOCUMENT" />
參數(shù)資料
型號: KIT33742DWEVB
廠商: Freescale Semiconductor
文件頁數(shù): 63/71頁
文件大小: 0K
描述: KIT FOR 33742 SBC WITH EHSCAN
標(biāo)準(zhǔn)包裝: 1
主要目的: 接口,CAN 控制器
已用 IC / 零件: MC33742
相關(guān)產(chǎn)品: MC33742DW-ND - IC SYSTEM BASE W/LIN 28-SOIC
MC33742DWR2-ND - IC SYSTEM BASE W/LIN 28-SOIC
MC33742SDW-ND - IC SYSTEM BASE W/LIN 28-SOIC
MC33742SDWR2-ND - IC SYSTEM BASE W/LIN 28-SOIC
Analog Integrated Circuit Device Data
66
Freescale Semiconductor
33742
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Introduction
This thermal addendum is provided as a supplement to the MC33742
technical datasheet. The addendum provides thermal performance
information that may be critical in the design and development of system
applications. All electrical, application, and packaging information is
provided in the data sheet.
Packaging and Thermal Considerations
The MC33742 is offered in a 28 pin SOICW exposed pad, single die
package. There is a single heat source (P), a single junction temperature
(TJ), and thermal resistance (RJA).
The stated values are solely for a thermal performance comparison of
one package to another in a standardized environment. This methodology
is not meant to and will not predict the performance of a package in an
application-specific environment. Stated values were obtained by
measurement and simulation according to the standards listed below.
Standards
Table 44. Thermal Performance Comparison
Thermal Resistance
[
C/W]
41
10
68
RJC
220
Notes:
1.
Per JEDEC JESD51-2 at natural convection, still air
condition.
2.
2s2p thermal test board per JEDEC JESD51-7.
3.
Per JEDEC JESD51-8, with the board temperature on the
center trace near the center lead.
4.
Single layer thermal test board per JEDEC JESD51-3.
5.
Thermal resistance between the die junction and the
package top surface; cold plate attached to the package top
surface and remaining surfaces insulated.
28-PIN SOICW
33742SOICW
EG SUFFIX (PB-FREE)
98ASB42345B
28-PIN SOICW
Note For package dimensions, refer to
98ASB42345B.
TJ
=
RJA
.
P
相關(guān)PDF資料
PDF描述
EGM12DTBS-S189 CONN EDGECARD 24POS R/A .156 SLD
EBM28DTBS-S189 CONN EDGECARD 56POS R/A .156 SLD
ESM12DTAS-S189 CONN EDGECARD 24POS R/A .156 SLD
EGM12DTAS-S189 CONN EDGECARD 24POS R/A .156 SLD
EBM28DTAS-S189 CONN EDGECARD 56POS R/A .156 SLD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
KIT3376MMA7330L 功能描述:加速傳感器開發(fā)工具 XYZ-AXIS ANALOG ACCELERO RoHS:否 制造商:Murata 工具用于評估:SCA3100-D04 加速:2 g 傳感軸:Triple Axis 接口類型:SPI 工作電壓:3.3 V
KIT3376MMA7331L 功能描述:加速傳感器開發(fā)工具 3-AXIS ANALOG OUT 4g /12g Dev Kit RoHS:否 制造商:Murata 工具用于評估:SCA3100-D04 加速:2 g 傳感軸:Triple Axis 接口類型:SPI 工作電壓:3.3 V
KIT3376MMA7331LC 功能描述:加速傳感器開發(fā)工具 3AXIS Angl Accelero Eval Kit RoHS:否 制造商:Murata 工具用于評估:SCA3100-D04 加速:2 g 傳感軸:Triple Axis 接口類型:SPI 工作電壓:3.3 V
KIT3376MMA7340L 功能描述:加速傳感器開發(fā)工具 XYZ-AXIS ANALOG ACCELERO RoHS:否 制造商:Murata 工具用于評估:SCA3100-D04 加速:2 g 傳感軸:Triple Axis 接口類型:SPI 工作電壓:3.3 V
KIT3376MMA7341L 功能描述:加速傳感器開發(fā)工具 3-AXIS ANALOG OUT 3g /11g Dev Kit RoHS:否 制造商:Murata 工具用于評估:SCA3100-D04 加速:2 g 傳感軸:Triple Axis 接口類型:SPI 工作電壓:3.3 V