參數(shù)資料
型號(hào)： IDT89HPES8T5ZHBC
廠商： IDT, Integrated Device Technology Inc
文件頁(yè)數(shù)： 8/31頁(yè)
文件大小： 0K
描述： IC PCI SW 8LANE 5PORT 324-BGA
標(biāo)準(zhǔn)包裝： 84
系列： PRECISE™
類(lèi)型： PCI Express 開(kāi)關(guān) - Gen1
應(yīng)用： 服務(wù)器，儲(chǔ)存，通信，嵌入式，消費(fèi)品
安裝類(lèi)型： 表面貼裝
封裝/外殼： 324-LBGA
供應(yīng)商設(shè)備封裝： 324-CABGA（19x19）
包裝： 托盤(pán)
其它名稱(chēng)： 89HPES8T5ZHBC
16 of 31
March 27, 2008
IDT 89HPES8T5 Data Sheet
Heat Sink
Table 17 lists heat sink requirements for the PES8T5 under two common usage scenarios. As shown in this table, a heat sink is not required in
most cases.
.
Thermal Usage Examples
The junction-to-ambient thermal resistance is a measure of a device’s ability to dissipate heat from the die to its surroundings in the absence of a
heat sink. The general formula to determine
θJA is:
θJA = (TJ - TA)/P
Thermal reliability of a device is generally assured when the actual value of TJ in the specific system environment being considered is less than the
maximum TJ specified for the device. Using an ambient temperature of 70oC and assuming a system with 1m/S airflow, the actual value of TJ is:
TJ(actual) = TA + P * θJA(eff) = 70oC + 2.4W * 9.9W/oC = 94oC
The actual TJ of 94oC is well below the maximum TJ of 125oC specified for the device (shown in Table 16). Therefore, no heat sink is needed in this
scenario. The formula is also useful from a system design perspective. It can be used to determine if a heat sink should be added to the device based
on some desired value of TJ. For example, if for reliability purposes the desired TJ is 100oC, then the maximum allowable TA is:
TA(allowed) = TJ(desired) - (P * θJA(effective))
TA(allowed) = 100oC - (2.4W * 9.9W/oC) = 100oC - 24oC = 76oC
An appropriate level of increased air flow and/or a heat sink can be added to achieve this lower ambient temperature. Please contact
ssdhelp@idt.com for further assistance.
Air Flow
Board Size
Board Layers
Heat Sink Requirement
Zero
Any
6 or more
No heat sink required
1 m/S or more
Any
No heat sink required
Table 17 Heat Sink Requirements Based on Air Flow and Board Characteristics
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