- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄2074 > ICS8534AY-01LFT (IDT, Integrated Device Technology Inc)IC CLOCK BUFFER MUX 2:22 64-TQFP PDF資料下載
參數(shù)資料
| 型號： | ICS8534AY-01LFT |
| 廠商： | IDT, Integrated Device Technology Inc |
| 文件頁數(shù)： | 6/21頁 |
| 文件大小： | 0K |
| 描述： | IC CLOCK BUFFER MUX 2:22 64-TQFP |
| 標準包裝： | 500 |
| 系列： | HiPerClockS™ |
| 類型： | 扇出緩沖器（分配），多路復用器 |
| 電路數(shù)： | 1 |
| 比率 - 輸入:輸出： | 2:22 |
| 差分 - 輸入:輸出： | 是/是 |
| 輸入： | CML，HCSL，LVDS，LVHSTL，LVPECL，SSTL |
| 輸出： | LVPECL |
| 頻率 - 最大： | 500MHz |
| 電源電壓： | 3.135 V ~ 3.465 V |
| 工作溫度： | 0°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 64-TQFP 裸露焊盤 |
| 供應商設備封裝： | 64-TQFP-EP（10x10） |
| 包裝： | 帶卷 (TR) |
| 其它名稱： | 8534AY-01LFT |
ICS8534AY-01 REVISION B MARCH 28, 2011
14
2011 Integrated Device Technology, Inc.
ICS8534-01 Data Sheet
LOW SKEW, 1-TO-22 DIFFERENTIAL-TO-3.3V LVPECL FANOUT BUFFER
EPAD Thermal Release Path
In order to maximize both the removal of heat from the package and
the electrical performance, a land pattern must be incorporated on
the Printed Circuit Board (PCB) within the footprint of the package
corresponding to the exposed metal pad or exposed heat slug on the
package, as shown in Figure 6. The solderable area on the PCB, as
defined by the solder mask, should be at least the same size/shape
as the exposed pad/slug area on the package to maximize the
thermal/electrical performance. Sufficient clearance should be
designed on the PCB between the outer edges of the land pattern
and the inner edges of pad pattern for the leads to avoid any shorts.
While the land pattern on the PCB provides a means of heat transfer
and electrical grounding from the package to the board through a
solder joint, thermal vias are necessary to effectively conduct from
the surface of the PCB to the ground plane(s). The land pattern must
be connected to ground through these vias. The vias act as “heat
pipes”. The number of vias (i.e. “heat pipes”) are application specific
and dependent upon the package power dissipation as well as
electrical conductivity requirements. Thus, thermal and electrical
analysis and/or testing are recommended to determine the minimum
number needed. Maximum thermal and electrical performance is
achieved when an array of vias is incorporated in the land pattern. It
is recommended to use as many vias connected to ground as
possible. It is also recommended that the via diameter should be 12
to 13mils (0.30 to 0.33mm) with 1oz copper via barrel plating. This is
desirable to avoid any solder wicking inside the via during the
soldering process which may result in voids in solder between the
exposed pad/slug and the thermal land. Precautions should be taken
to eliminate any solder voids between the exposed heat slug and the
land pattern. Note: These recommendations are to be used as a
guideline only. For further information, refer to the Application Note
on the Surface Mount Assembly of Amkor’s Thermally/Electrically
Enhance Leadframe Base Package, Amkor Technology.
Figure 6. Assembly for Exposed Pad Thermal Release Path - Side View (drawing not to scale)
GROUND PLANE
LAND PATTERN
SOLDER
THERMAL VIA
EXPOSED HEAT SLUG
(GROUND PAD)
PIN
PIN PAD
SOLDER
PIN
PIN PAD
SOLDER
相關PDF資料 |
PDF描述 |
|---|---|
| ICS85352AYILFT | IC CLOCK MUX 2:12 700MHZ 48-TQFP |
| ICS85356AMILF | IC CLOCK MUX 2:1 900MHZ 20-SOIC |
| ICS85357AG-11LF | IC CLOCK MUX 4:1/2:1 20-TSSOP |
| ICS8535AG-31LFT | IC CLOCK BUFFER MUX 2:4 20-TSSOP |
| ICS8535AGI-01LFT | IC CLOCK BUFFER MUX 2:4 20-TSSOP |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| ICS8534BMI-13LF | 功能描述:IC CLOCK BUFFER MUX 2:4 16-SOIC RoHS:是 類別:集成電路 (IC) >> 時鐘/計時 - 時鐘緩沖器，驅動器 系列:HiPerClockS™ 標準包裝:74 系列:- 類型:扇出緩沖器（分配） 電路數(shù):1 比率 - 輸入:輸出:1:10 差分 - 輸入:輸出:是/是 輸入:HCSL, LVCMOS, LVDS, LVPECL, LVTTL 輸出:HCSL，LVDS 頻率 - 最大:400MHz 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:32-VFQFN 裸露焊盤 供應商設備封裝:32-QFN（5x5） 包裝:管件 |
| ICS8534BMI-13LFT | 功能描述:IC CLOCK BUFFER MUX 2:4 16-SOIC RoHS:是 類別:集成電路 (IC) >> 時鐘/計時 - 時鐘緩沖器，驅動器 系列:HiPerClockS™ 標準包裝:74 系列:- 類型:扇出緩沖器（分配） 電路數(shù):1 比率 - 輸入:輸出:1:10 差分 - 輸入:輸出:是/是 輸入:HCSL, LVCMOS, LVDS, LVPECL, LVTTL 輸出:HCSL，LVDS 頻率 - 最大:400MHz 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:32-VFQFN 裸露焊盤 供應商設備封裝:32-QFN（5x5） 包裝:管件 |
| ICS85352AYILF | 功能描述:IC CLOCK MUX 2:12 700MHZ 48-TQFP RoHS:是 類別:集成電路 (IC) >> 時鐘/計時 - 時鐘緩沖器，驅動器 系列:HiPerClockS™ 產品培訓模塊:High Bandwidth Product Overview 標準包裝:1,000 系列:Precision Edge® 類型:扇出緩沖器（分配） 電路數(shù):1 比率 - 輸入:輸出:1:4 差分 - 輸入:輸出:是/是 輸入:CML，LVDS，LVPECL 輸出:CML 頻率 - 最大:2.5GHz 電源電壓:2.375 V ~ 2.625 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-VFQFN 裸露焊盤，16-MLF? 供應商設備封裝:16-MLF?（3x3） 包裝:帶卷 (TR) |
| ICS85352AYILFT | 功能描述:IC CLOCK MUX 2:12 700MHZ 48-TQFP RoHS:是 類別:集成電路 (IC) >> 時鐘/計時 - 時鐘緩沖器，驅動器 系列:HiPerClockS™ 標準包裝:74 系列:- 類型:扇出緩沖器（分配） 電路數(shù):1 比率 - 輸入:輸出:1:10 差分 - 輸入:輸出:是/是 輸入:HCSL, LVCMOS, LVDS, LVPECL, LVTTL 輸出:HCSL，LVDS 頻率 - 最大:400MHz 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:32-VFQFN 裸露焊盤 供應商設備封裝:32-QFN（5x5） 包裝:管件 |
| ICS85354AK-01LF | 功能描述:IC CLOCK MUX 2:1/1:2 16-VFQFPN RoHS:是 類別:集成電路 (IC) >> 時鐘/計時 - 時鐘緩沖器，驅動器 系列:HiPerClockS™ 標準包裝:74 系列:- 類型:扇出緩沖器（分配） 電路數(shù):1 比率 - 輸入:輸出:1:10 差分 - 輸入:輸出:是/是 輸入:HCSL, LVCMOS, LVDS, LVPECL, LVTTL 輸出:HCSL，LVDS 頻率 - 最大:400MHz 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:32-VFQFN 裸露焊盤 供應商設備封裝:32-QFN（5x5） 包裝:管件 |
發(fā)布緊急采購，3分鐘左右您將得到回復。