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參數(shù)資料
| 型號： | HSDL-2300 |
| 英文描述： | Infrared Compliant 4 Mb/s 3.3 V Transceiver(4 Mb/s 3.3 V 紅外順應(yīng)收發(fā)器) |
| 中文描述： | 紅外符合4 Mb / s的3.3伏收發(fā)器（4 Mb / s的3.3伏紅外順應(yīng)收發(fā)器） |
| 文件頁數(shù)： | 2/16頁 |
| 文件大?。?/td> | 219K |
| 代理商： | HSDL-2300 |
2
Package
The HSDL-2300 module consists
of Optical Sub-Assemblies
(OSAs), an Electrical Sub-
Assembly (ESA), and an
integrated EMI shield. There are
two package options: Option
#001 with guide pins, and Option
#002 without guide pins.
Drawings of the two options
package are illustrated in Figure 3
and Figure 4.
New Package Benefits
The new package that consists of
OSAs and ESA with the
combination of integrated EMI
shield utilizes existing in-house
high-volume assembly processes
to ensure high quality and high
volume supply. The integrated
EMI shield helps to ensure low
EMI emission and high immunity
to EMI field, thus enhancing
reliable performance.
Optical Sub-Assemblies
(OSAs)
The Optical Sub-Assemblies
include a Transmitter and a
Receiver.
The Transmitter has a discrete
emitter that utilizes Transparent-
Substrate Aluminium Gallium
Arsenide (TS AlGaAs) LED
technology that offers high-speed
and high optical output efficiency
performance with an integral lens
in a clear molded package.
The Receiver utilizes a discrete
silicon PIN photo-diode with an
integral lens in a molded package
and contains a dye to absorb
visible light. The Receiver lens is
designed such that it magnifies
the effective area of the PIN
photo-diode to enhance
sensitivity. And the PIN photo-
diode and pre-amplifier power
supplies are filtered to attenuate
noise from external sources.
Electrical Sub-Assembly
(ESA)
The Electrical Sub-Assembly
(ESA) consists of a double-sided
printed circuit board on which a
BiCMOS Integrated Circuit (IC)
and various surface-mount
passive circuit elements are
attached. The IC contains an LED
driver and a receiver that
provides a single output channel,
RXD.
Application Information
The Application Engineering
group in Agilent’s
Communications Semiconductor
Solution Division is available to
assist you with the technical
understanding associated with
HSDL-2300 infrared transceiver
module. You can contact them
through your local sales
I/O Pins Configuration Table
Pin
1
2
3
4
5
6
7
8
9
10
Description
LED Anode
Transmitter Data Input
Receiver Data Output
Ground
Ground
Mode 1
Mode 0
FIR Select
Analog Ground
Supply Voltage
Symbol
LEDA
TXD
RXD
GND
GND
MD1
MD0
FIR_SEL
AGND
V
CC
CAUTION: The BiCMOS inherent to the design of this component increases the component’s
susceptibility to damage from electrostatic discharge (ESD). It is advised that normal static
precautions be taken in handling and assembly of this component to prevent damage and/or
degradation which may be induced by ESD.
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| HSDL-4400 | High-Performance IR Emitter Photodiode in Subminiature SMT Package(高性能 IR發(fā)射器光二極管（微型SMT封裝）) |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HSDL-2300#001 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:FIBER OPTIC TRANSCEIVER |
| HSDL-2300#002 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:FIBER OPTIC TRANSCEIVER |
| HSDL3000 | 制造商:AGILENT 制造商全稱:AGILENT 功能描述:Agilent HSDL-3000 # 007/017 IrDA?? Data Compliant 115.2 kbps Infrared Transceiver |
| HSDL-3000 | 制造商:AGILENT 制造商全稱:AGILENT 功能描述:IrDA Data Compliant 115.2 kbps Infrared Transceiver |
| HSDL-3000#007 | 功能描述:紅外收發(fā)器 1m 3-5V SIR Front RoHS:否 制造商:Vishay Semiconductors 波長:900 nm 連續(xù)數(shù)據(jù)傳輸:115.2 Kbit/s 傳輸距離:1 m 輻射強度:60 mW/sr 半強度角度:44 deg 脈沖寬度:2 us 最大上升時間:100 ns 最大下降時間:100 ns LED 電源電壓:- 0.5 V to 6 V 最大正向電流:80 mA 工作電壓:2.4 V to 5.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 尺寸:6 mm x 3.1 mm x 1.9 mm 封裝 / 箱體: 封裝:Reel |
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