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參數(shù)資料
| 型號(hào)： | HSDL-2300 |
| 英文描述： | Infrared Compliant 4 Mb/s 3.3 V Transceiver(4 Mb/s 3.3 V 紅外順應(yīng)收發(fā)器) |
| 中文描述： | 紅外符合4 Mb / s的3.3伏收發(fā)器（4 Mb / s的3.3伏紅外順應(yīng)收發(fā)器） |
| 文件頁(yè)數(shù)： | 15/16頁(yè) |
| 文件大?。?/td> | 219K |
| 代理商： | HSDL-2300 |
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15
2.0 Recommended Solder
Paste/Cream Volume for
Castellation Joints.
The printed solder paste
volume required per
castellation pad is 0.36 cubic
mm
±
15%
(based on either no-
clean or aqueous solder cream
types with typically 60 to 65%
solid content by volume).
2.1 Recommended Metal
Solder Stencil Aperture
To ensure adequate printed
solder paste volume, the
following combination of metal
stencil aperture and metal stencil
thickness should be used:
3.0 Pick and Place
Misalignment Tolerance and
Product Self-Alignment after
Solder Reflow
If the printed solder paste volume
is adequate,
the HSDL-2300
will self-align
after solder
reflow. Units should be properly
reflowed in IR-Hot Air convection
over using the recommended
reflow profile. The direction of
board travel does not matter.
3.1 Tolerance for X-Axis
Alignment of Castellation
Misalignment of castellation to
the land pad should not exceed
0.2 mm or approximately half the
width of the castellation during
placement of the unit. The
castellations will completely self-
align to the pads during solder
reflow.
3.2 Tolerance for Rotational
(theta) Misalignment
Unit when mounted should not be
rotated more than 3 with
reference to center X-Y as
specified in Figure 2.0.
See Figure 4.0
t, nominal stencil thickness
mm
0.127
0.152
0.203
w, the width of aperture is fixed at 0.7 mm (0.028 inches)
l, length of aperture
mm
3.8
±
0.1
3.4
±
0.1
2.7
±
0.1
inches
0.005
0.006
0.008
inches
0.150
±
0.004
0.134
±
0.004
0.106
±
0.004
Allowable Misalignment Tolerance
x-direction
theta-direction
≤
0.2 mm (0.008 inches)
±
3
Figure 4.0. Solder Paste Stencil Aperture.
APERTURE AS PER
LAND DIMENSIONS
SOLDER PASTE
METAL STENCIL
l
w
t (STENCIL THICKNESS)
Unit with theta misalignment of
more than 3 does not completely
self-align after reflow. Unit with
3 rotational of theta
misalignment self-align
completely after solder reflow.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HSDL-2300#001 | 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:FIBER OPTIC TRANSCEIVER |
| HSDL-2300#002 | 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:FIBER OPTIC TRANSCEIVER |
| HSDL3000 | 制造商:AGILENT 制造商全稱(chēng):AGILENT 功能描述:Agilent HSDL-3000 # 007/017 IrDA?? Data Compliant 115.2 kbps Infrared Transceiver |
| HSDL-3000 | 制造商:AGILENT 制造商全稱(chēng):AGILENT 功能描述:IrDA Data Compliant 115.2 kbps Infrared Transceiver |
| HSDL-3000#007 | 功能描述:紅外收發(fā)器 1m 3-5V SIR Front RoHS:否 制造商:Vishay Semiconductors 波長(zhǎng):900 nm 連續(xù)數(shù)據(jù)傳輸:115.2 Kbit/s 傳輸距離:1 m 輻射強(qiáng)度:60 mW/sr 半強(qiáng)度角度:44 deg 脈沖寬度:2 us 最大上升時(shí)間:100 ns 最大下降時(shí)間:100 ns LED 電源電壓:- 0.5 V to 6 V 最大正向電流:80 mA 工作電壓:2.4 V to 5.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 尺寸:6 mm x 3.1 mm x 1.9 mm 封裝 / 箱體: 封裝:Reel |
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