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參數(shù)資料
| 型號： | HSDL-2300 |
| 英文描述： | Infrared Compliant 4 Mb/s 3.3 V Transceiver(4 Mb/s 3.3 V 紅外順應(yīng)收發(fā)器) |
| 中文描述： | 紅外符合4 Mb / s的3.3伏收發(fā)器（4 Mb / s的3.3伏紅外順應(yīng)收發(fā)器） |
| 文件頁數(shù)： | 11/16頁 |
| 文件大?。?/td> | 219K |
| 代理商： | HSDL-2300 |
11
Figure 5. Reflow Profile.
representative for additional
details.
Figure 5 is a straight line
representation of a nominal
temperature profile for a
convective IR reflow solder
process. The temperature profile
is divided into four process zones
with four
T/
time temperature
change rates. The
T/
time
temperature change rates are
detailed in Table 1. The
temperatures are measured at the
component to printed-circuit (pc)
board connections.
In
process zone P1
, the pc
board and HSDL-2300
castellation I/O pins are heated to
a temperature of 125C to
activate the flux in the solder
paste. The temperature ramp up
rate, R1, is limited to 3C per
second to allow for even heating
of both the pc board and
HSDL-2300 castellation I/O pins.
Process zone P2
should be of
sufficient time duration to dry the
solder paste. The temperature is
raised to a level just below the
liquidus point of the solder,
usually 170C (338F).
Process zone P3
is the solder
reflow zone. In zone P3, the
temperature is quickly raised
above the liquidus point of solder
to 230C (446F) for optimum
results. The dwell time above the
liquidus point of solder should be
between 15 and 90 seconds. It
usually takes about 15 seconds to
assure proper coalescing of the
solder balls into liquid solder and
the formation of good solder
connections. Beyond a dwell time
of 90 seconds, the intermetallic
growth within the solder
connections becomes excessive,
resulting in the formation of weak
and unreliable connections. The
temperature is then rapidly
reduced to a point below the
solidus temperature of the solder,
usually 170C (338F), to allow
the solder within the connections
to freeze solid.
Process zone P4
is the cool
down after solder freeze. The
cool down rate, R5, from the
liquidus point of the solder to
25C (77F) should not exceed
–3C (26.6F) per second
maximum. This limitation is
necessary to allow the pc board
0
t-TIME (SECONDS)
P2
SOLDER PASTE DRY
T
200
183
170
150
125
100
50
15
60
90
120
150
195
30
45
75
105
135
165 180
210
230
P1
HEAT UP
P3
SOLDER
REFLOW
P4
COOL DOWN
25
R1
R2
R3
R4
R5
90 sec.
MAX.
ABOVE
183°C
Table 1. Reflow Process Zones.
Process Zone
Heat Up
Solder Paste Dry
Solder Reflow
Symbol
P1, R1
P2, R2
P3, R3
P4, R4
P4, R5
T
T/
Time
3C/s max.
0.5C/s max.
4.0C/s typ.
–4.0C/s typ.
–3C/s max.
25C to 125C
125C to 170C
170C to 230C (235C max.)
230C to 170C
170C to 25C
Cool Down
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
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