參數(shù)資料
型號(hào)： GR500
廠商： KEMET Corporation
英文描述： HIGH RELIABILITY SOLID TANTALUM
中文描述： 高可靠性固體鉭
文件頁(yè)數(shù)： 10/24頁(yè)
文件大?。?/td> 686K
代理商： GR500
GR500/T210
KEMET Electronics Corporation P.O. Box 5928 Greenville, S.C. 29606 864/963-6300
10
KEMET
3. The power dissipated in the equivalent series
resistance of the capacitor must not exceed the
limits specified in Table II.
The power dissipated may be calculated from the
following:
P =E
Z
Where E = ripple voltage across capacitor in rms volts
Z = capacitor impedance in ohms at the specified fre-
quency (typical values from Figure 7)
R = equivalent series resistance in ohms (typical val-
ues from Figure 7)
Ripple voltage, as limited by power dissipation, may be
determined as follows:
Where P max=maximum permissible power from
Table III
R = ESR from Figure 7
E max (85°C) = 0.9 E max (25°C)
E max (125°C) = 0.4 E max (25°C)
TABLE II
Maximum Permissible Power Dissipation at 25°C Ambient
T210 Polar Capacitors
Case Size
A
B
C
D
Watts
0.090
0.100
0.125
0.180
Reverse Voltage —
The solid tantalum capacitor is basically
a polar device and can be damaged by serious reversals of
polarity even for short periods of time, depending upon the
circuit impedance. However, some short duration reversal is
permissable as shown in Table III.
TABLE III
Permissible Reverse Voltage
Temp.
°C
25
85
125
% of Forward
Rated Voltage
15
5
1
Shelf Life —
Shelf life is particularly difficult to define for
the solid tantalum capacitor. Extended periods of storage at
high temperature will cause some small change in leakage
current which usually returns to normal upon short time
application of working voltage. Storage at low temperatures
causes little or no degradation of leakage current. Long-term
studies of capacitance and dissipation factor shift for as long
as 45,000 hours indicate only minor variations (usually less
than 2%) in these parameters.
Installation —
Mounting procedures should not place
undue strain on terminals, particularly the positive end with
its glass-metal seal. Attention to soldering technique should
avoid excessive heat transfer which might remelt the capac-
itor’s internal solder and cause loss of hermeticity or short
circuits. Potting materials should not produce excessive cur-
ing exotherms or shrinkage pressures.
APPLICATIONS INFORMATION GR500/T210 (Continued)
2
R
2
E max (25°C) = Z
P max
R
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