
GP1201FSS18
8/9
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
www.dynexsemi.com
ASSOCIATED PUBLICATIONS
Title
Application Note
Number
AN4502
AN4503
AN4504
AN4505
AN4506
AN4507
AN4508
AN4869
AN5000
AN5167
AN5384
Electrostatic handling precautions
An introduction to IGBTs
IGBT ratings and characteristics
Heatsin
k
re
q
uirements for IGBT modules
Calculating the junction temperature of power semiconductors
Gate drive considerations to ma
x
imise IGBT efficiency
P
arallel operation of IGBTs
–
punch through vs non-punch through characteristics
Guidance notes for formulating technical en
q
uiries
P
rinciple of rating parallel connected IGBT modules
Short circuit withstand capa
b
ility in IGBTs
Driving Dyne
x
Semincoductor IGBT modules with Concept gate drivers
POWER ASSEMBLY CAPABILITY
The
P
ower Assem
b
ly group was set up to provide a support service for those customers re
q
uiring more than the
b
asic
semiconductor, and has developed a fle
x
i
b
le range of heatsin
k
and clamping systems in line with advances in device voltages and
current capa
b
ility of our semiconductors.
W
e offer an e
x
tensive range of air and li
q
uid cooled assem
b
lies covering the full range of circuit designs in general use today. The
Assem
b
ly group continues to offer high
q
uality engineering support dedicated to designing new units to satisfy the growing needs of
our customers.
Using the latest CAD methods our team of design and applications engineers aim to provide the
P
ower Assem
b
ly Complete
Solution (
P
ACs).
HEATSINKS
The
P
ower Assem
b
ly group has its own proprietary range of e
x
truded aluminium heatsin
k
s. They have
b
een designed to optimise
the performance of Dyne
x
semiconductors. Data with respect to air natural, forced air and li
q
uid cooling (with flow rates) is
availa
b
le on re
q
uest.
For further information on device clamps, heatsin
k
s and assem
b
lies, please contact your nearest sales representative or customer
service office.