參數(shù)資料
型號(hào): GCIXP1250-232
英文描述: Microprocessor
中文描述: 微處理器
文件頁數(shù): 138/148頁
文件大?。?/td> 1601K
代理商: GCIXP1250-232
Intel
IXP1250 Network Processor
138
Datasheet
4.3.9.3
SDRAM Signal Protocol
This section describes the SDRAM timing parameters referenced in the SDRAM timing diagrams
that follow. This nomenclature is consistent with most JEDEC standard SDRAM devices.
tRP
tRP is the minimum number of cycles after a precharge cycle that a bank may be opened (or
"RASd"). The
IXP1200 Network Processor Family Micrcode Programmer
s Reference Manual
refers to this as the tRP Precharge Time. Also referred to as
PRECHARGE command period
in
SDRAM datasheets.
tRASmin
tRASmin is the minimum number of cycles that a bank must be open before it can be closed using
a precharge command. The maximum time that a bank may be open, tRASmax, is not checked,
because the IXP1250 SDRAM Controller methodology is to close all banks after the usage is
complete. The
IXP1200 Network Processor Family Micrcode Programmer
s Reference Manual
refers to this as the tRASmin Active Command Period. Also referred to as
ACTIVE to
PRECHARGE command period
in SDRAM datasheets.
tRCD
tRCD is the number of cycles between the bank opening (or "RAS") and any read or write
command (or "CAS"). The
IXP1200 Network Processor Family Micrcode Programmer
s
Reference Manual
refers to this as the tRCD RAS to CAS Delay. Also referred to as
ACTIVE to
READ or WRITE delay
in SDRAM datasheets.
tRRD
tRRD is the number of cycles between successive bank openings, or RAS cycles. The
IXP1200
Network Processor Family Micrcode Programmer
s Reference Manual
refers to this as the tRRD
Bank to Bank Delay Time. Also referred to as
ACTIVE bank A to ACTIVE bank B command
in
SDRAM datasheets.
tRC
tRC is the SDRAM bank cycle time, indicating that the minimum time that a command may be
active. For most cases, this is the sum of tRP and tRASmin, although there are some SDRAM data
sheets where the absolute time for tRC (in ns) is not equal to the sum (in ns) of tRP and tRASmin.
In these cases, typically when rounding up to an even number of clock cycles, they are equivalent.
Since the SDRAM Controller CSRs are programmed with a number of clock cycles, these
Table 52. Signal Delay Deratings for T
val
and T
ctl
Signal
Maximum Derating (ns/pF)
(IX Bus Speed)
Minimum Derating (ns/pF)
(IX Bus Speed)
83 MHz
100 MHz
116 MHz
83 MHz
100 MHz
116 MHz
SDCLK
0.053
0.025
DQM
0.065
0.06
0.031
0.03
0.025
0.015
WE_L
0.065
0.06
0.031
0.03
0.025
0.015
RAS_L
0.065
0.06
0.031
0.03
0.025
0.015
CAS_L
0.065
0.06
0.031
0.03
0.025
0.015
MADR[14:0]
0.065
0.06
0.031
0.03
0.025
0.015
MDATA[63:0]
0.095
0.09
0.035
0.03
0.025
0.015
MDATA_ECC[7:0]
0.095
0.09
0.035
0.03
0.025
0.015
相關(guān)PDF資料
PDF描述
GCK101 Analog IC
GCK131 Microcontroller
GCM-3.15A Fuse
GCM-4A Fuse
GCM-5A Fuse
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
GCIXP1250BA 功能描述:IC MPU NETWORK 166MHZ 520-BGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標(biāo)準(zhǔn)包裝:40 系列:MPC83xx 處理器類型:32-位 MPC83xx PowerQUICC II Pro 特點(diǎn):- 速度:267MHz 電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 封裝/外殼:516-BBGA 裸露焊盤 供應(yīng)商設(shè)備封裝:516-PBGAPGE(27x27) 包裝:托盤
GCIXP1250BB 功能描述:IC MPU NETWORK 200MHZ 520-BGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標(biāo)準(zhǔn)包裝:40 系列:MPC83xx 處理器類型:32-位 MPC83xx PowerQUICC II Pro 特點(diǎn):- 速度:267MHz 電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 封裝/外殼:516-BBGA 裸露焊盤 供應(yīng)商設(shè)備封裝:516-PBGAPGE(27x27) 包裝:托盤
GCIXP1250BC 功能描述:IC MPU NETWORK 232MHZ 520-BGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標(biāo)準(zhǔn)包裝:40 系列:MPC83xx 處理器類型:32-位 MPC83xx PowerQUICC II Pro 特點(diǎn):- 速度:267MHz 電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 封裝/外殼:516-BBGA 裸露焊盤 供應(yīng)商設(shè)備封裝:516-PBGAPGE(27x27) 包裝:托盤
GCJ0335C5C0JR50D 制造商:MURATA 制造商全稱:Murata Manufacturing Co., Ltd. 功能描述:Chip Monolithic Ceramic Capacitors
GCJ0335C5C1AR50D 制造商:MURATA 制造商全稱:Murata Manufacturing Co., Ltd. 功能描述:Chip Monolithic Ceramic Capacitors