參數資料
型號: FDZ208P
廠商: FAIRCHILD SEMICONDUCTOR CORP
元件分類: JFETs
英文描述: P-Channel 30 Volt PowerTrench
中文描述: 12.5 A, 30 V, 0.0105 ohm, P-CHANNEL, Si, POWER, MOSFET
封裝: ULTRA THIN, BGA-30
文件頁數: 1/6頁
文件大?。?/td> 185K
代理商: FDZ208P
May 2004
2004 Fairchild Semiconductor Corporation
FDZ208P Rev C3 (W)
FDZ208P
P-Channel 30 Volt PowerTrench BGA MOSFET
General Description
Combining Fairchild
’s advanced 30 Volt P-Channel
Trench II Process with
±
25 Volts Vgs. Abs. Max Gate
Rating for the ultimate low Rds Battery Protection
MOSFET.
This
MOSFET
breakthrough in packaging technology which enables
the device to combine excellent thermal transfer
characteristics, high current handling capability, ultra-
low profile packaging, low gate charge, and low R
DS(ON)
.
also
embodies
a
Applications
Battery management
Load switch
Battery protection
Features
–12.5 A, –30 V. R
DS(ON)
= 10.5 m
@ V
GS
= –10 V
R
DS(ON)
= 16.5 m
@ V
GS
= –4.5 V
Occupies only 14 mm
2
of PCB area. Only 42% of
the area of SO-8
Ultra-thin package: less than 0.8 mm height when
mounted to PCB
3.5 x 4 mm
2
footprint
High power and current handling capability
Pin 1
D
D
S
S
S
D
S
S
S
S
D
S
S
S
S
D
S
S
S
S
D
D
D
D
D
D
D
D
D
G
Bottom
Pin 1
F
Top
S
G
D
Absolute Maximum Ratings
T
A
=25
o
C unless otherwise noted
Symbol
Parameter
V
DSS
Drain-Source Voltage
V
GSS
Gate-Source Voltage
I
D
Drain Current – Continuous
– Pulsed
Power Dissipation (Steady State)
P
D
T
J
, T
stg
Operating and Storage Junction Temperature Range
Ratings
–30
±
25
–12.5
–60
2.2
1.0
–55 to +150
Units
V
V
A
W
(Note 1a)
(Note 1a)
(Note 1a)
°
C
Thermal Characteristics
R
θ
JA
Thermal Resistance, Junction-to-Ambient
R
θ
JB
Thermal Resistance, Junction-to-Ball
R
θ
JC
Thermal Resistance, Junction-to-Case
(Note 1a)
(Note 1)
(Note 1)
56
4.5
0.6
°
C/W
Package Marking and Ordering Information
Device Marking
Device
208P
FDZ208P
Reel Size
7’’
Tape width
8mm
Quantity
3000 units
F
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PDF描述
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相關代理商/技術參數
參數描述
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