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參數(shù)資料
| 型號(hào)： | FDN302P_NL |
| 廠商： | FAIRCHILD SEMICONDUCTOR CORP |
| 元件分類： | 小信號(hào)晶體管 |
| 英文描述： | P-Channel 2.5V Specified PowerTrench MOSFET |
| 中文描述： | 2400 mA, 20 V, P-CHANNEL, Si, SMALL SIGNAL, MOSFET |
| 封裝： | SUPERSOT-3 |
| 文件頁(yè)數(shù)： | 2/5頁(yè) |
| 文件大小： | 103K |
| 代理商： | FDN302P_NL |
FDN302P Rev C(W)
Electrical Characteristics
T
A
= 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off Characteristics
BVDSS
Drain–Source Breakdown Voltage
VGS = 0 V, ID = –250
A
–20
V
BVDSS
===TJ
Breakdown Voltage Temperature
Coefficient
ID = –250
A, Referenced to 25°C
–12
mV/
°C
IDSS
Zero Gate Voltage Drain Current
VDS = –16 V,
VGS = 0 V
–1
A
IGSSF
Gate–Body Leakage, Forward
VGS = 12 V,
VDS = 0 V
100
nA
IGSSR
Gate–Body Leakage, Reverse
VGS = –12 V
VDS = 0 V
–100
nA
On Characteristics
(Note 2)
VGS(th)
Gate Threshold Voltage
VDS = VGS, ID = –250
A
–0.6
–1.0
–1.5
V
VGS(th)
===TJ
Gate Threshold Voltage
Temperature Coefficient
ID = –250
A, Referenced to 25°C
3
mV/
°C
RDS(on)
Static Drain–Source
On–Resistance
VGS = –4.5 V,
ID = –2.4 A
VGS = –2.5 V,
ID = –2 A
VGS = –4.5 V, ID = –2.4A, TJ =125
°C
44
64
58
55
80
84
m
ID(on)
On–State Drain Current
VGS = –4.5 V,
VDS = –5 V
–10
A
gFS
Forward Transconductance
VDS = –5 V,
ID = –2.4 A
10
S
Dynamic Characteristics
Ciss
Input Capacitance
882
pF
Coss
Output Capacitance
211
pF
Crss
Reverse Transfer Capacitance
VDS = –10 V,
V GS = 0 V,
f = 1.0 MHz
112
pF
Switching Characteristics (Note 2)
td(on)
Turn–On Delay Time
13
23
ns
tr
Turn–On Rise Time
11
20
ns
td(off)
Turn–Off Delay Time
25
40
ns
tf
Turn–Off Fall Time
VDD = –10 V,
ID = –1 A,
VGS = –4.5 V,
RGEN = 6
15
27
ns
Qg
Total Gate Charge
9
14
nC
Qgs
Gate–Source Charge
2
nC
Qgd
Gate–Drain Charge
VDS = –10 V,
ID = –2.4 A,
VGS = –4.5 V
3nC
Drain–Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain–Source Diode Forward Current
–0.42
A
VSD
Drain–Source Diode Forward
Voltage
VGS = 0 V,
IS = –0.42
(Note 2)
–0.7
–1.2
V
Notes:
1.
RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design.
a) 250
°C/W when mounted on a
0.02 in2 pad of 2 oz. copper.
b) 270°C/W when mounted on a
minimum pad.
Scale 1 : 1 on letter size paper
2.
Pulse Test: Pulse Width
≤=300 s, Duty Cycle ≤=2.0%
F
DN30
2
P
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