參數(shù)資料
型號(hào): FDMA1027P
廠商: FAIRCHILD SEMICONDUCTOR CORP
元件分類: 小信號(hào)晶體管
英文描述: CAP CER 10UF 6.3V X5R 1206
中文描述: 2200 mA, 20 V, 2 CHANNEL, P-CHANNEL, Si, SMALL SIGNAL, MOSFET, MO-229VCCC
封裝: 2 X 2 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MICROFET-6
文件頁數(shù): 1/6頁
文件大?。?/td> 108K
代理商: FDMA1027P
October 2005
FDMA1027P
Dual P-Channel PowerTrench
MOSFET
2005 Fairchild Semiconductor Corporation
FDMA1027P Rev C1 (W)
General Description
This device is designed specifically as a single package
solution for the battery charge switch in cellular handset
and other ultra-portable applications. It features two
independent P-Channel MOSFETs with low on-state
resistance for minimum conduction losses. When
connected in the typical common source configuration,
bi-directional current flow is possible.
The MicroFET 2x2 package offers exceptional thermal
performance for it's physical size and is well suited to
linear mode applications.
Features
–3.0 A, –20V. R
DS(ON)
= 120 m
@ V
GS
= –4.5V
R
DS(ON)
= 160 m
@ V
GS
= –2.5V
R
DS(ON)
= 240 m
@ V
GS
= –1.8V
Low profile – 0.8 mm maximum – in the new package
MicroFET 2x2 mm
3
2
1
4
5
6
Absolute Maximum Ratings
T
A
=25
o
C unless otherwise noted
Symbol
Parameter
V
DSS
Drain-Source Voltage
V
GSS
Gate-Source Voltage
Drain Current – Continuous
I
D
– Pulsed
Power Dissipation for Single Operation
P
D
Ratings
–20
±
8
–2.2
–6
1.4
0.7
–55 to +150
Units
V
V
A
(Note 1a)
(Note 1a)
(Note 1b)
W
T
J
, T
STG
Operating and Storage Junction Temperature Range
°
C
Thermal Characteristics
R
θ
JA
Thermal Resistance, Junction-to-Ambient
R
θ
JA
Thermal Resistance, Junction-to-Ambient
R
θ
JA
Thermal Resistance, Junction-to-Ambient
R
θ
JA
Thermal Resistance, Junction-to-Ambient
(Note 1a)
86 (Single Operation)
173 (Single Operation)
69 (Dual Operation)
151 (Dual Operation)
(Note 1b)
(Note 1c)
(Note 1d)
°
C/W
Package Marking and Ordering Information
Device Marking
Device
027
FDMA1027P
Reel Size
7 in
Tape width
8 mm
Quantity
3000 units
F
MicroFET
S1
G1
D1
S2
G2
D2
PIN 1
S1 G1 D2
D1 G2 S2
D1 D2
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