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參數(shù)資料
| 型號： | FC80960HA40SL2GW |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | CAP CER 3300PF 250V 10% X7R 0805 |
| 中文描述： | 32-BIT, 40 MHz, RISC PROCESSOR, PQFP208 |
| 封裝： | PLASTIC, QFP-208 |
| 文件頁數(shù)： | 4/102頁 |
| 文件大?。?/td> | 828K |
| 代理商： | FC80960HA40SL2GW |
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80960HA/HD/HT
iv
Advance Information
Datasheet
Figures
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80960Hx Block Diagram .......................................................................................1
80960Hx 168-Pin PGA Pinout — View from Top (Pins Facing Down) ...............12
80960Hx 168-Pin PGA Pinout — View from Bottom (Pins Facing Up)...............13
80960Hx 208-Pin PQ4 Pinout.............................................................................18
Measuring 80960Hx PGA Case Temperature ....................................................23
80960Hx Device Identification Register ..............................................................26
VCC5 Current-Limiting Resistor..........................................................................30
AC Test Load ......................................................................................................37
CLKIN Waveform ................................................................................................38
Output Delay Waveform......................................................................................38
Output Delay Waveform......................................................................................38
Output Float Waveform.......................................................................................39
Input Setup and Hold Waveform.........................................................................39
NMI, XINT7:0 Input Setup and Hold Waveform ..................................................39
Hold Acknowledge Timings.................................................................................40
Bus Backoff (BOFF) Timings ..............................................................................40
TCK Waveform....................................................................................................41
Input Setup and Hold Waveforms for T
BSIS1
and T
BSIH1
....................................41
Output Delay and Output Float for T
BSOV1
and T
BSOF1
......................................42
Output Delay and Output Float Waveform for T
BSOV2
and T
BSOF2
....................42
Input Setup and Hold Waveform for T
BSIS2
and T
BSIH2
......................................42
Rise and Fall Time Derating at 85°C and Minimum V
CC
....................................43
I
CC
Active (Power Supply) vs. Frequency...........................................................43
I
CC
Active (Thermal) vs. Frequency....................................................................44
Output Delay or Hold vs. Load Capacitance.......................................................44
Output Delay vs. Temperature............................................................................45
Output Hold Times vs. Temperature...................................................................45
Output Delay vs. V
CC
..........................................................................................45
Cold Reset Waveform.........................................................................................46
Warm Reset Waveform.......................................................................................47
Entering ONCE Mode .........................................................................................48
Non-Burst, Non-Pipelined Requests without Wait States ...................................49
Non-Burst, Non-Pipelined Read Request with Wait States.................................50
Non-Burst, Non-Pipelined Write Request with Wait States.................................51
Burst, Non-Pipelined Read Request without Wait States, 32-Bit Bus.................52
Burst, Non-Pipelined Read Request with Wait States, 32-Bit Bus......................53
Burst, Non-Pipelined Write Request without Wait States, 32-Bit Bus.................54
Burst, Non-Pipelined Write Request with Wait States, 32-Bit Bus......................55
Burst, Non-Pipelined Read Request with Wait States, 16-Bit Bus......................56
Burst, Non-Pipelined Read Request with Wait States, 8-Bit Bus........................57
Non-Burst, Pipelined Read Request without Wait States, 32-Bit Bus.................58
Non-Burst, Pipelined Read Request with Wait States, 32-Bit Bus......................59
Burst, Pipelined Read Request without Wait States, 32-Bit Bus.........................60
Burst, Pipelined Read Request with Wait States, 32-Bit Bus..............................61
Burst, Pipelined Read Request with Wait States, 8-Bit Bus................................62
Burst, Pipelined Read Request with Wait States, 16-Bit Bus..............................63
Using External READY........................................................................................64
Terminating a Burst with BTERM........................................................................65
BREQ and BSTALL Operation............................................................................66
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| FC80960HA33SL2GV | 80960HA/HD/HT 32-Bit High-Performance Superscalar Processor |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| FC80960HD32SL2GL | 功能描述:IC MPU I960HD 3V 32MHZ 208-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標(biāo)準(zhǔn)包裝:60 系列:SCC 處理器類型:Z380 特點(diǎn):全靜電 Z380 CPU 速度:20MHz 電壓:5V 安裝類型:表面貼裝 封裝/外殼:144-LQFP 供應(yīng)商設(shè)備封裝:144-LQFP 包裝:托盤 |
| FC80960HD50SL2GM | 制造商:INTEL 制造商全稱:Intel Corporation 功能描述:80960HA/HD/HT 32-Bit High-Performance Superscalar Processor |
| FC80960HD66SL2GN | 功能描述:IC MPU I960HD 3V 66MHZ 208-SQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標(biāo)準(zhǔn)包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點(diǎn):- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA（25x25） 包裝:托盤 |
| FC80960HD80 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| FC80960HD80SL2LZ | 功能描述:IC I960HD 3.3V 80MHZ 208QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標(biāo)準(zhǔn)包裝:40 系列:MPC83xx 處理器類型:32-位 MPC83xx PowerQUICC II Pro 特點(diǎn):- 速度:267MHz 電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 封裝/外殼:516-BBGA 裸露焊盤 供應(yīng)商設(shè)備封裝:516-PBGAPGE（27x27） 包裝:托盤 |
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