Maxim/Dallas Semiconductor cannot assume responsibility for use of any circuitry other than circuitry entirely e" />
參數(shù)資料
型號: DS32512DK
廠商: Maxim Integrated Products
文件頁數(shù): 36/130頁
文件大?。?/td> 0K
描述: KIT DEMO FOR DS32512
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
設(shè)計(jì)資源: DS32512 Gerber Files
標(biāo)準(zhǔn)包裝: 1
主要目的: 電信,線路接口單元(LIU)
已用 IC / 零件: DS32512
DS32506/DS32508/DS32512
130 of 130
Maxim/Dallas Semiconductor cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim/Dallas Semiconductor product.
No circuit patent licenses are implied. Maxim/Dallas Semiconductor reserves the right to change the circuitry and specifications without notice at any time.
Ma x i m In tegra t ed P roduc ts , 1 2 0 S a n Ga brie l D r iv e , Sun ny vale , CA 94 086 40 8 -7 3 7 -76 00
2008 Maxim Integrated Products
The Maxim logo is a registered trademark of Maxim Integrated Products, Inc. The Dallas logo is a registered trademark of Dallas Semiconductor Corporation.
17.
DATA SHEET REVISION HISTORY
REVISION
DATE
DESCRIPTION
PAGES
CHANGED
062906
Initial data sheet release.
Added Internal Receive Enable (ITRE) pin to Table 7-1. Short Pin Descriptions.
14
Changed VDD18 tolerance from
±10% to ±5% (Table 7-1. Short Pin Descriptions).
15
Added Internal Receive Enable (ITRE) pin description to Table 7-5. Hardware
Interface Pin Description.
20
Changed VDD18 tolerance from
±10% to ±5% (Table 7-10. Power-Supply Pin
Descriptions).
23
In Section 8.2.8, removed “Note that internal termination is only available when a
microprocessor interface is enabled.”
25
Changed RXP to TXN in the third paragraph of Section 8.2.9: Driver Monitor and
Output Failure Detection
.
26
In Section 8.3.1, removed “Note that internal termination is only available when a
microprocessor interface is enabled.”
30
Removed Section 8.12: Initialization.
48
In the Absolute Maximum Ratings section, changed the VDD18 supply range from
”-0.1V to +1.98V” to “-0.1V to +1.89V”.
In Table 11-1, changed VDD18 from 1.62V (min) to 1.71V (min) and 1.98V (max) to
1.89V (max).
92
In Table 11-2, changed all IDD18, IDD33, IDDTTS18, and IDDTTS33 typ and max values.
93
In Table 11-2 to Table 11-10, changed VDD18 tolerance from
±10% to ±5%.
93, 94, 96,
97, 98,
103, 105
In Table 12-1, added ITRE to ball R10.
106
091307
In Figure 12-2, Figure 12-5, and Figure 12-8, changed ball R10 from N.C. to ITRE for
DS32512, DS32508, and DS32506 hardware-interface-only pin assignments.
111, 117,
123
040808
In Figure 12-8 (left half), corrected typos where some pins for port 7 were listed (do
not exist on the DS32506). Changed pins A10, A11, B10, B11, F11, and G11 to N.C.
Changed pins C11, D11, E11, G10, R9, and V4 to VSS.
123
103008
In Section 9.7, clarified register bit text descriptions for LINE.RSR:BPVC and
LINE.RSR:EXCZ.
83
相關(guān)PDF資料
PDF描述
DS3253DK KIT DEMO FOR DS3253
DS26522DK KIT DESIGN FOR DS26522
EMM08DSEF-S13 CONN EDGECARD 16POS .156 EXTEND
DS26528DK KIT DESIGN FOR DS26528
ESM12DRTN-S13 CONN EDGECARD 24POS .156 EXTEND
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DS32512N 功能描述:網(wǎng)絡(luò)控制器與處理器 IC 12-Port DS3/E3/STS-1 Line Interface Unit RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS32512N# 功能描述:網(wǎng)絡(luò)控制器與處理器 IC 12-Port DS3/E3/STS-1 Line Interface Unit RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS32512N+ 功能描述:網(wǎng)絡(luò)控制器與處理器 IC 12-Port DS3/E3/STS-1 Line Interface Unit RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS32512NA2 制造商:Maxim Integrated Products 功能描述:DS32512 X12 DS3/E3 LIU REVA2 IND - Rail/Tube
DS32512NW 功能描述:網(wǎng)絡(luò)控制器與處理器 IC RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray