參數(shù)資料
型號: DS3112+
廠商: Maxim Integrated Products
文件頁數(shù): 33/133頁
文件大?。?/td> 0K
描述: IC MUX TEMPE T3/E3 256-BGA
產品培訓模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標準包裝: 40
控制器類型: 調幀器,多路復用器
接口: 并行/串行
電源電壓: 3.135 V ~ 3.465 V
電流 - 電源: 150mA
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 256-LBGA
供應商設備封裝: 256-PBGA(27x27)
包裝: 管件
產品目錄頁面: 1419 (CN2011-ZH PDF)
DS3112
128 of 133
Figure 14-6. T3 Stuff Block Structure
M1
Subframe
F4
Stuff
Bit 1
Info
Bit 2
Info
Bit 3
Info
Bit 4
Info
Bit 5
Info
Bit 6
Info
Bit 7
Info
Bit 8
......
Info
Bit 84
M2
Subframe
F4
Info
Bit 1
Stuff
Bit 2
Info
Bit 3
Info
Bit 4
Info
Bit 5
Info
Bit 6
Info
Bit 7
Info
Bit 8
......
Info
Bit 84
M3
Subframe
F4
Info
Bit 1
Info
Bit 2
Stuff
Bit 3
Info
Bit 4
Info
Bit 5
Info
Bit 6
Info
Bit 7
Info
Bit 8
......
Info
Bit 84
M4
Subframe
F4
Info
Bit 1
Info
Bit 2
Info
Bit 3
Stuff
Bit 4
Info
Bit 5
Info
Bit 6
Info
Bit 7
Info
Bit 8
......
Info
Bit 84
M5
Subframe
F4
Info
Bit 1
Info
Bit 2
Info
Bit 3
Info
Bit 4
Stuff
Bit 5
Info
Bit 6
Info
Bit 7
Info
Bit 8
......
Info
Bit 84
M6
Subframe
F4
Info
Bit 1
Info
Bit 2
Info
Bit 3
Info
Bit 4
Info
Bit 5
Stuff
Bit 6
Info
Bit 7
Info
Bit 8
......
Info
Bit 84
M7
Subframe
F4
Info
Bit 1
Info
Bit 2
Info
Bit 3
Info
Bit 4
Info
Bit 5
Info
Bit 6
Stuff
Bit 7
Info
Bit 8
......
Info
Bit 84
14.8 E13 Basics
E13 multiplexing is a two-step process of merging 16 E1 lines into a single E3 line. First, four of the E1
lines are merged into a single E2 rate and then four E2 rates are merged to form the E3. The first step of
this process is called a E12 function since it is merging E1 lines into E2. The second step of this process
is called a E23 function since it is merging E2 lines into a E3. The term E13 implies that both E12 and
E23 are being performed to map 16 E1 lines into the E3. These two steps are independent and will be
discussed separately.
Table 14-5. E Carrier Rates
E CARRIER
LEVEL
NOMINAL DATA
RATE (Mbps)
E1
2.048
E2
8.448
E3
34.368
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DS3112+ 功能描述:網絡控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3112+W 功能描述:網絡控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3112D1 功能描述:網絡控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3112D1+ 功能描述:網絡控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3112DK 功能描述:網絡開發(fā)工具 DS3112 Dev Kit RoHS:否 制造商:Rabbit Semiconductor 產品:Development Kits 類型:Ethernet to Wi-Fi Bridges 工具用于評估:RCM6600W 數(shù)據速率:20 Mbps, 40 Mbps 接口類型:802.11 b/g, Ethernet 工作電源電壓:3.3 V