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參數(shù)資料
| 型號(hào)： | DS_K7N163601A |
| 廠商： | SAMSUNG SEMICONDUCTOR CO. LTD. |
| 英文描述： | 512Kx36 & 1Mx18 Pipelined NtRAM |
| 中文描述： | 512Kx36 |
| 文件頁(yè)數(shù)： | 1/24頁(yè) |
| 文件大?。?/td> | 279K |
| 代理商： | DS_K7N163601A |
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512Kx36 & 1Mx18 Pipelined N
t
RAM
TM
- 1 -
Rev 3.0
Nov. 2003
K7N161801A
K7N163601A
Document Title
512Kx36 & 1Mx18-Bit Pipelined N
t
RAM
TM
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.
Revision History
Rev. No.
0.0
0.1
0.2
0.3
1.0
2.0
2.1
3.0
Remark
Preliminary
Preliminary
Preliminary
Preliminary
Final
Final
Final
Final
History
1. Initial document.
1. Add JTAG Scan Order
1. Add x32 org and industrial temperature .
2. Add 165FBGA package
1. Speed bin merge.
From K7N1636(32/18)09A to K7N1636(32/18)01A.
2. AC parameter change.
tOH(min)/tLZC(min) from 0.8 to 1.5 at -25
tOH(min)/tLZC(min) from 1.0 to 1.5 at -22
tOH(min)/tLZC(min) from 1.0 to 1.5 at -20
1. Final spec release.
1. Release Icc on page 14.
1. Delete 119BGA package.
2. Correct the Ball Size of 165 FBGA.
1. Delete x32 Org.
2. Delete the 225MHz speed bin
Draft Date
March. 21. 2001
May. 10. 2001
Aug. 30. 2001
Dec. 26. 2001
May. 10 .2002
May. 22. 2002
April. 04. 2003
Nov. 17, 2003
part #
From
To
-25
440
470
-22
400
430
-20
370
400
-16
340
350
-13
280
290
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