參數(shù)資料
型號(hào): CE77
廠商: Fujitsu Limited
英文描述: Semicustom CMOS Embedded array
中文描述: 半定制嵌入式陣列的CMOS
文件頁數(shù): 3/24頁
文件大?。?/td> 167K
代理商: CE77
CE77 Series
3
CHIP STRUCTURE
The chip layout of the CE77 series consists of two major areas : chip peripheral area and basic cell area.
The chip peripheral area contains the input/output buffer cells for interfacing with external devices and the
associated bonding pads. The basic cell area contains some of input/output buffer cells, the unit cells and the
compiled cells.
Chip configuration
Bonding pad
I/O buffer cell
Basic cell area
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