
CDC930
133-MHz DIFFERENTIAL CLOCK SYNTHESIZER/DRIVER FOR PC MOTHERBOARDS
WITH 3-STATE OUTPUTS
SCAS641 – JULY 2000
5
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Supply voltage range, V
DD
Input voltage range, V
I
(see Note 1)
Voltage range applied to any output in the high-impedance state or power-off state,
V
O
(see Note 1)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Current into any output in the low state, I
O
Input clamp current, I
IK
(V
I
< 0)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(V
I
< V
DD
)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current , I
OK
(V
O
< 0)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(V
O
< V
DD
)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance,
θ
JA
(see Note 2)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum power dissipation at T
A
= 55
°
C (in still air) (see Note 3)
Operating free-air temperature range, T
A
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
stg
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
–0.5 V to 4.6 V
–0.5 V to V
DD
+ 0.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
–0.5 V to V
DD
+ 0.5 V
2
×
rated I
OL
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
–18 mA
18 mA
–50 mA
50 mA
74
°
C/W
1.3 W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
0
°
C to 85
°
C
–65
°
C to 150
°
C
260
°
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with EIA/JEDEC Std JESD51, except for the through-hole packages,
which use a trace length of zero. The absolute maximum power dissipation allowed at TA = 55
°
C (in still air) is 1.3 W.
3. The maximum package power dissipation is calculated using a junction temperature of 1505C and a board trace length of 750 mils.
For more information, refer to the Package Thermal Considerationsapplication note in the ABT Advanced BiCMOS Technology Data
Book literature number SCBD002.
DISSIPATION RATING TABLE
DERATING FACTOR
ABOVE TA = 25
°
C
12.468 mW/
°
C
PACKAGE
TA
≤
25
°
C
POWER RATING
TA = 70
°
C
POWER RATING
TA = 85
°
C
POWER RATING
DL
1558.6 mW
997.5 mW
810.52 mW
This is the inverse of the traditional junction-to-case thermal resistance (R
θ
JA) and uses a board-mounted device
at 74
°
C/W.