
BYV32G-200
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 NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 01 — 11 January 2011
3 of 11
NXP Semiconductors
BYV32G-200
Dual ultrafast power diode
4.
Limiting values
Table 4.
In accordance with the Absolute Maximum Rating System (IEC 60134).
Limiting values
Symbol
V
RRM
V
RWM
V
R
I
O(AV)
Parameter
repetitive peak reverse voltage
crest working reverse voltage
reverse voltage
average output current
Conditions
Min
-
-
-
-
Max
200
200
200
20
Unit
V
V
V
A
DC
square-wave pulse; 
δ
 = 0.5 ; T
mb
≤
 115 °C; 
both diodes conducting; see 
Figure 1
; 
see 
Figure 2
δ
 = 0.5 ; t
p
= 25 μs; T
mb
≤
 115 °C; per diode
t
p
= 8.3 ms; sine-wave pulse; T
j(init)
= 25 °C; 
per diode
t
p
= 10 ms; sine-wave pulse; T
j(init)
= 25 °C; 
per diode
δ
 = 0.001 ; t
p
= 2 μs
t
p
= 100 μs
I
FRM
I
FSM
repetitive peak forward current
non-repetitive peak forward 
current
-
-
20
137
A
A
-
125
A
I
RRM
I
RSM
repetitive peak reverse current
non-repetitive peak reverse 
current
storage temperature
junction temperature
electrostatic discharge voltage
-
-
0.2
0.2
A
A
T
stg
T
j
V
ESD
-40
-
-
150
150
8
°C
°C
kV
HBM; C = 250 pF; R = 1.5 k
; all pins
Fig 1.
Forward power dissipation as a function of 
average forward current; sinusoidal waveform; 
maximum values
Fig 2.
Forward power dissipation as a function of 
average forward current; square waveform; 
maximum values
0
12
8
4
003aac978
4
8
12
0
1.9
a = 1.57
2.2
2.8
4.0
I
F(AV)
 (A)
P
tot
(W)
0
15
10
5
003aac979
5
10
15
0
0.5
0.2
0.1
I
F(AV)
 (A)
P
tot
(W)
δ
 = 1