參數(shù)資料
型號: BU3076HFV-TR
廠商: Rohm Semiconductor
文件頁數(shù): 14/22頁
文件大?。?/td> 0K
描述: IC CLOCK GEN 1CH HVSOF6
標(biāo)準(zhǔn)包裝: 3,000
類型: 時鐘/頻率發(fā)生器
PLL:
主要目的: 數(shù)碼相機(jī)
輸入: 時鐘
輸出: 時鐘
電路數(shù): 1
比率 - 輸入:輸出: 1:1
差分 - 輸入:輸出: 無/無
頻率 - 最大: 67.5MHz
電源電壓: 2.85 V ~ 3.6 V
工作溫度: -5°C ~ 75°C
安裝類型: 表面貼裝
封裝/外殼: 6-SMD
供應(yīng)商設(shè)備封裝: HVSOF6
包裝: 帶卷 (TR)
DS601F2
21
CS5340
Confidential Draft
3/11/08
6. PACKAGE DIMENSIONS
1.
“D” and “E1” are reference datums and do not included mold flash or protrusions, but do include mold
mismatch and are measured at the parting line, mold flash or protrusions shall not exceed 0.20 mm per
side.
2.
Dimension “b” does not include dambar protrusion/intrusion. Allowable dambar protrusion shall be
0.13 mm total in excess of “b” dimension at maximum material condition. Dambar intrusion shall not re-
duce dimension “b” by more than 0.07 mm at least material condition.
3.
These dimensions apply to the flat section of the lead between 0.10 and 0.25 mm from lead tips.
THERMAL CHARACTERISTICS
INCHES
MILLIMETERS
NOTE
DIM
MIN
NOM
MAX
MIN
NOM
MAX
A
--
0.043
--
1.10
A1
0.002
0.004
0.006
0.05
--
0.15
A2
0.03346
0.0354
0.037
0.85
0.90
0.95
b
0.00748
0.0096
0.012
0.19
0.245
0.30
D
0.193
0.1969
0.201
4.90
5.00
5.10
E
0.248
0.2519
0.256
6.30
6.40
6.50
E1
0.169
0.1732
0.177
4.30
4.40
4.50
e
--
0.026 BSC
--
0.65 BSC
--
L
0.020
0.024
0.028
0.50
0.60
0.70
JEDEC #: MO-153
Controlling Dimension is Millimeters
Parameter
Symbol
Min
Typ
Max
Unit
Allowable Junction Temperature
-
135
°C
Junction to Ambient Thermal Impedance
θ
JA
-75-
°C/W
16L TSSOP (4.4 mm BODY) PACKAGE DRAWING
E
N
1 23
e
b2
A1
A2
A
D
SEATING
PLANE
E11
L
SIDE VIEW
END VIEW
TOP VIEW
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