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參數(shù)資料
| 型號(hào)： | BGY212 |
| 廠(chǎng)商： | NXP Semiconductors N.V. |
| 英文描述： | UHF amplifier module |
| 中文描述： | 超高頻放大器模塊 |
| 文件頁(yè)數(shù)： | 7/11頁(yè) |
| 文件大?。?/td> | 132K |
| 代理商： | BGY212 |
1999 Aug 23
7
Philips Semiconductors
Preliminary specification
UHF amplifier module
BGY212A
SOLDERING
The indicated temperatures are those at the solder
interfaces.
Advised solder types are types with a liquidus less than or
equal to 210
°
C.
Solder dots or solder prints must be large enough to wet
the contact areas.
Soldering can be carried out using a conveyor oven, a hot
air oven, an infrared oven or a combination of these ovens.
A double reflow process is permitted.
Hand soldering is not recommended because the
soldering iron tip can exceed the maximum permitted
temperature of 250
°
C and damage the module.
In case handsoldering is needed, recommendations can
be found in RNR-45-98-A-0485.
The maximum allowed temperature is 250
°
C for a
maximum of 5 seconds.
The maximum ramp-up is 10
°
C per second.
The maximum cool-down is 5
°
C per second.
Cleaning
The following fluids may be used for cleaning:
Alcohol
Bio-Act (Terpene Hydrocarbon)
Acetone.
Ultrasonic cleaning should not be used since this can
cause serious damage to the product.
Fig.12 Recommended reflow temperature profile.
handbook, halfpage
0
200
100
0
1
5
2
3
4
MGM159
t (min)
T
(
°
C)
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| BGY212A | UHF amplifier module |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| BGY212A | 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:UHF amplifier module |
| BGY240S | 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:UHF amplifier module |
| BGY241 | 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:UHF amplifier module |
| BGY280 | 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:UHF amplifier module |
| BGY282 | 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:dual band UHF amplifier module for GSM900 and GSM1800 |
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