參數(shù)資料
型號: BCM856DS
廠商: NXP Semiconductors N.V.
元件分類: 功率晶體管
英文描述: PNP-PNP matched double transistors
中文描述: PNP-PNP 匹配雙晶體管
封裝: BCM856BS<SOT363 (TSSOP6)|<<http://www.nxp.com/packages/SOT363.html<1<Always Pb-free,;BCM856DS<SOT457 (TSOP6)|<<http://www.nxp.com/packages/SOT457.html<1<Always Pb-f
文件頁數(shù): 9/14頁
文件大?。?/td> 104K
代理商: BCM856DS
BCM856BS_BCM856DS_1
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 7 August 2008
9 of 14
NXP Semiconductors
BCM856BS; BCM856DS
PNP/PNP matched double transistors
11. Packing information
[1]
For further information and the availability of packing methods, see
Section 15
.
[2]
T1: normal taping
[3]
T2: reverse taping
12. Soldering
Table 9.
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number
Package
Description
Packing methods
Packing quantity
3000
10000
-135
-165
-135
-165
-135
-165
-135
-165
BCM856BS
SOT363
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
[2]
-115
[3]
-125
BCM856BS/DG SOT363
[2]
-115
[3]
-125
BCM856DS
SOT457
[2]
-115
[3]
-125
BCM856DS/DG SOT457
[2]
-115
[3]
-125
Fig 13. Reflow soldering footprint SOT363 (SC-88)
solder lands
solder resist
occupied area
solder paste
sot363_fr
2.65
2.35
0.4 (2
×
)
0.6
(2
×
)
0.5
(4
×
)
0.5
(4
×
)
0.6
(4
×
)
0.6
(4
×
)
1.5
1.8
Dimensions in mm
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BCM856DS/DG 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:PNP/PNP matched double transistors
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