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參數(shù)資料
| 型號： | B300W35A102XYG |
| 廠商： | ON Semiconductor |
| 文件頁數(shù)： | 1/15頁 |
| 文件大小： | 0K |
| 描述： | IC PROCESSOR AUDIO 24BIT 35WLCSP |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 系列： | BelaSigna® 300 |
| 類型： | 音頻處理器 |
| 應(yīng)用： | 便攜式設(shè)備 |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 35-VFBGA，WLCSP |
| 供應(yīng)商設(shè)備封裝： | 35-WLCSP（3.63x2.68） |
| 包裝： | 帶卷 (TR) |
Semiconductor Components Industries, LLC, 2011
March, 2011 Rev. 7
1
Publication Order Number:
B300/D
BelaSigna 300
Audio Processor for Portable
Communication Devices
Introduction
BelaSigna 300 is a DSPbased mixedsignal audio processing
system that delivers superior audio clarity without compromising size
or battery life. The processor is specifically designed for monaural
portable communication devices requiring high performance audio
processing capabilities and programming flexibility when formfactor
and power consumption are key design constraints.
The efficient dualMAC 24bit CFX DSP core, together with the
HEAR configurable accelerator signal processing engine, high speed
debugging interface, advanced algorithm security system, stateof
theart analog front end, Class D output stage and much more,
constitute an entire system on a single chip, which enables
manufacturers to create a range of advanced and unique products. The
system features a high level of instructional parallelism, providing
highly efficient computing capability. It can simultaneously execute
multiple advanced adaptive noise reduction and echo cancellation
algorithms, and uses an asymmetric dualcore patented architecture to
allow for more processing in fewer clock cycles, resulting in reduced
power consumption.
BelaSigna 300 is supported by a comprehensive suite of
development tools, handson training, full technical support and a
network of solution partners offering software and engineering
services to help speed product design and shorten time to market.
Key Features
Flexible DSPbased System: a complete DSPbased, mixedsignal
audio system consisting of the CFX core, a fully programmable,
highly cycleefficient, dualHarvard architecture 24bit DSP
utilizing explicit parallelism; the HEAR configurable accelerator for
optimized signal processing; and an efficient input/output controller
(IOC) along with a full complement of peripherals and interfaces,
which optimize the architecture for audio processing at extremely
low power consumption
Ultralowpower:typically 15 mA
Excellent Audio Fidelity: up to 110 dB input dynamic range,
exceptionally low system noise and low group delay
Miniature Form Factor: available in a miniature 3.63 mm x
2.68 mm x 0.92 mm (including solder balls) WLCSP package. In
addition, BelaSigna 300 is also available in a bigger DFN package
allowing easier assembly and PCB routing
Multiple Audio Input Sources: four input channels from five input
sources (depends on package selection) can be used simultaneously
for multiple microphones or direct analog audio inputs
Full Range of Configurable Interfaces: including a fast I2Cbased
interface for download, debug and general communication, a highly
configurable PCM interface to stream data into and out of the device,
a highspeed UART, an SPI port and 5 GPIOs
http://onsemi.com
DFN44
D SUFFIX
CASE 506BU
MARKING DIAGRAM
WLCSP35
W SUFFIX
CASE 567AG
BELASIGNA300
3502G
XXXXYZZ
BELASIGNA300 = Device Code
35
= Number of Balls
02
= Revision of Die
G
= PbFree
XXXX
= Date Code
Y
= Assembly Plant Identifier
= (May be Two Characters)
ZZ
= Traceability Code
Device
Package
ORDERING INFORMATION
B300W35A102XYG
WLCSP
(PbFree)
B300D44A102XXG
DFN
(PbFree)
Shipping
2500 Units /
Reel
2500 Units /
Reel
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