- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄366542 > AM45DL3208GB70IT (ADVANCED MICRO DEVICES INC) Stacked Multi-Chip Package (MCP) Flash Memory and SRAM PDF資料下載
參數(shù)資料
| 型號(hào)： | AM45DL3208GB70IT |
| 廠商： | ADVANCED MICRO DEVICES INC |
| 元件分類： | 存儲(chǔ)器 |
| 英文描述： | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| 中文描述： | SPECIALTY MEMORY CIRCUIT, PBGA73 |
| 封裝： | 8 X 11.60 MM, FBGA-73 |
| 文件頁(yè)數(shù)： | 38/66頁(yè) |
| 文件大小： | 1196K |
| 代理商： | AM45DL3208GB70IT |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)當(dāng)前第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)
36
Am45DL3208G
March 12, 2004
P R E L I M I N A R Y
Table 17.
Write Operation Status
Notes:
1. DQ5 switches to ‘1’ when an Embedded Program or Embedded Erase operation has exceeded the maximum timing limits.
Refer to the section on DQ5 for more information.
2. DQ7 and DQ2 require a valid address when reading status information. Refer to the appropriate subsection for further
details.
3. When reading write operation status bits, the system must always provide the bank address where the Embedded Algorithm
is in progress. The device outputs array data if the system addresses a non-busy bank.
Status
DQ7
(Note 2)
DQ7#
0
DQ6
Toggle
Toggle
DQ5
(Note 1)
0
0
DQ3
N/A
1
DQ2
(Note 2)
No toggle
Toggle
RY/BY#
0
0
Standard
Mode
Embedded Program Algorithm
Embedded Erase Algorithm
Erase
Suspend
Mode
Erase-Suspend-
Read
Erase
Suspended Sector
Non-Erase
Suspended Sector
1
No toggle
0
N/A
Toggle
1
Data
Data
Data
Data
Data
1
Erase-Suspend-Program
DQ7#
Toggle
0
N/A
N/A
0
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AM45DL3208GB85IS | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM45DL3208GB85IT | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM45DL3208GT70IS | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM45DL3208GT70IT | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM45DL3208GT85IS | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AM45DL3208GB85IS | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM45DL3208GB85IT | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM45DL3208GT70IS | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM45DL3208GT70IT | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM45DL3208GT85IS | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。