參數(shù)資料
型號(hào): AM45DL3208GB70IT
廠商: ADVANCED MICRO DEVICES INC
元件分類(lèi): 存儲(chǔ)器
英文描述: Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
中文描述: SPECIALTY MEMORY CIRCUIT, PBGA73
封裝: 8 X 11.60 MM, FBGA-73
文件頁(yè)數(shù): 2/66頁(yè)
文件大?。?/td> 1196K
代理商: AM45DL3208GB70IT
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相關(guān)PDF資料
PDF描述
AM45DL3208GB85IS Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
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AM45DL3208GT70IS Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM45DL3208GT70IT Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AM45DL3208GB85IS 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM45DL3208GB85IT 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM45DL3208GT70IS 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM45DL3208GT70IT 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM45DL3208GT85IS 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM