(TA = 25°C unless otherwise noted) Parameter Ra" />
參數資料
型號: ADUC816BSZ
廠商: Analog Devices Inc
文件頁數: 10/68頁
文件大?。?/td> 0K
描述: IC MCU 8K FLASH ADC/DAC 52MQFP
產品培訓模塊: Process Control
標準包裝: 1
系列: MicroConverter® ADuC8xx
核心處理器: 8052
芯體尺寸: 8-位
速度: 12.58MHz
連通性: I²C,SPI,UART/USART
外圍設備: PSM,溫度傳感器,WDT
輸入/輸出數: 34
程序存儲器容量: 8KB(8K x 8)
程序存儲器類型: 閃存
EEPROM 大?。?/td> 640 x 8
RAM 容量: 256 x 8
電壓 - 電源 (Vcc/Vdd): 2.7 V ~ 5.5 V
數據轉換器: A/D 7x16b; D/A 1x12b
振蕩器型: 內部
工作溫度: -40°C ~ 85°C
封裝/外殼: 52-QFP
包裝: 托盤
產品目錄頁面: 738 (CN2011-ZH PDF)
ADuC816
ABSOLUTE MAXIMUM RATINGS
(TA = 25°C unless otherwise noted)
Parameter
Ratings
AVDD to AGND
0.3 V to +7 V
AVDD to DGND
0.3 V to +7 V
DVDD to AGND
0.3 V to +7 V
DVDD to DGND
0.3 V to +7 V
AGND to DGND1
0.3 V to +0.3 V
AVDD to DVDD
2 V to +5 V
Analog Input Voltage to AGND2
0.3 V to AVDD +0.3 V
Reference Input Voltage to AGND
0.3 V to AVDD +0.3 V
AIN/REFIN Current (Indefinite)
30 mA
Digital Input Voltage to DGND
0.3 V to DVDD +0.3 V
Digital Output Voltage to DGND
0.3 V to DVDD +0.3 V
Operating Temperature Range
40°C to +85°C
Storage Temperature Range
65°C to +150°C
Junction Temperature
150°C
JA
Thermal Impedance (MQFP)
90°C/W
JA
Thermal Impedance (LFCSP
Base Floating)
52°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec)
215°C
Infrared (15 sec)
220°C
1 AGND and DGND are shorted internally on the ADuC816.
2 Applies to P1.2 to P1.7 pins operating in analog or digital input modes.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
REV. A
–18–
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