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參數(shù)資料
| 型號： | ADS8519IRHBR |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | ADC |
| 英文描述： | 3-CH 16-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PQCC32 |
| 封裝： | 5 X 5 MM, QFN-32 |
| 文件頁數(shù)： | 21/25頁 |
| 文件大?。?/td> | 396K |
| 代理商： | ADS8519IRHBR |
www.ti.com
PRODUCTPREVIEW
TIMING REQUIREMENTS, TA = –40°C to 85°C
25
26
27
28
29
30
31
32
16
15
14
13
12
11
10
9
24 23 22 21 20 19 18 17
BUSY
PWRD
VDIG
VANA
R1IN
AGND1
R2IN
R3IN
NC
DATA
DATACLK
SYNC
DGND
EXT/INT
SB/BTC
NC
CAP
CS
NC
AGND2
NC
R/C
NC
T
AG
NC
REF
NC
1
2
3
4
5
6
7
8
Thermal Pad
VDIG
VANA
BUSY
CS
R/C
NC
TAG
NC
DATA
DATACLK
SYNC
R1IN
AGND1
NC
CAP
AGND2
NC
REF
DGND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
R2IN
SB/BTC
EXT/INT
PWRD
NC
R3IN
SLAS462 – JUNE 2007
PARAMETER
MIN
TYP
MAX
UNIT
tw1
Pulse duration, convert
40
ns
td1
Delay time, BUSY from R/C low
6
20
ns
tw2
Pulse duration, BUSY low
2.2
μs
td2
Delay time, BUSY, after end of conversion
5
ns
td3
Delay time, aperture
5
ns
tconv
Conversion time
2.2
μs
tacq
Acquisition time
1.8
μs
tconv + tacq Cycle time
4
μs
td4
Delay time, R/C Low to internal DATACLK output
270
ns
tc1
Cycle time, internal DATACLK
110
ns
td5
Delay time, data valid to internal DATACLK high
15
35
ns
td6
Delay time, data valid after internal DATACLK low
20
35
ns
tc2
Cycle time, external DATACLK
35
ns
tw3
Pulse duration, external DATACLK high
15
ns
tw4
Pulse duration, external DATACLK low
15
ns
tsu1
Setup time, R/C rise/fall to external DATACLK high
15
ns
tsu2
Setup time, R/C transition to CS transition
10
ns
td7
Delay time, SYNC, after external DATACLK high
3
35
ns
td8
Delay time, data valid from external DATACLK high
2
20
ns
td9
Delay time, CS rising edge to external DATACLK rising edge
10
ns
td10
Delay time, previous data available after CS, R/C low
2
μs
tsu3
Setup time, BUSY transition to first external DATACLK
5
ns
td11
Delay time, final external DATACLK to BUSY rising edge
1
μs
tsu3
Setup time, TAG valid
0
ns
th1
Hold time, TAG valid
2
ns
DB PACKAGE
RHB PACKAGE
(TOP VIEW)
Note:
The package thermal pad must be soldered
to the printed circuit board for thermal and
mechanical performance.
Copyright 2007, Texas Instruments Incorporated
5
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