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參數(shù)資料
| 型號： | ADS5444_07 |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | 13-BIT 250 MSPS ANALOG-TO-DIGITAL CONVERTER |
| 中文描述： | 13位250 MSPS的模擬數(shù)字轉(zhuǎn)換器 |
| 文件頁數(shù)： | 22/27頁 |
| 文件大?。?/td> | 1031K |
| 代理商： | ADS5444_07 |
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Power Supplies
The use of low noise power supplies with adequate decoupling is recommended. Linear supplies are the
preferred choice versus switched ones, which tend to generate more noise components that can be coupled to
the ADS5444.
Layout Information
The evaluation board represents a good guideline of how to layout the board to obtain the maximum
performance out of the ADS5444. General design rules as the use of multilayer boards, single ground plane for
ADC ground connections and local decoupling ceramic chip capacitors should be applied. The input traces
should be isolated from any external source of interference or noise, including the digital outputs as well as the
clock traces. The clock signal traces should also be isolated from other signals, especially in applications where
low jitter is required as high IF sampling.
PowerPAD PACKAGE
The PowerPAD package is a thermally enhanced standard size IC package designed to eliminate the use of
bulky heatsinks and slugs traditionally used in thermal packages. This package can be easily mounted using
standard printed circuit board (PCB) assembly techniques, and can be removed and replaced using standard
repair procedures.
Assembly Process
1. Prepare the PCB top-side etch pattern including etch for the leads as well as the thermal pad as illustrated in
the Mechanical Data section.
2. Place a 6-by-6 array of thermal vias in the thermal pad area. These holes should be 13 mils in diameter. The
small size prevents wicking of the solder through the holes.
3. It is recommended to place a small number of 25 mil diameter holes under the package, but outside the
thermal pad area to provide an additional heat path.
4. Connect all holes (both those inside and outside the thermal pad area) to an internal copper plane (such as a
ground plane).
5. Do not use the typical web or spoke via connection pattern when connecting the thermal vias to the ground
plane. The spoke pattern increases the thermal resistance to the ground plane.
6. The top-side solder mask should leave exposed the terminals of the package and the thermal pad area.
7. Cover the entire bottom side of the PowerPAD vias to prevent solder wicking.
8. Apply solder paste to the exposed thermal pad area and all of the package terminals.
ADS5444
SLWS162A–AUGUST 2005–REVISED FEBRUARY 2006
Application Information (continued)
The ADS5444 digital outputs are LVDS compatible.
The ADS5444 uses two power supplies. For the analog portion of the design, a 5 V AVDD is used, while for the
digital outputs supply (DRVDD) we recommend the use of 3.3 V. All the ground pins are marked as GND,
although AGND pins and DRGND pins are not tied together inside the package.
Besides performance oriented rules, care has to be taken when considering the heat dissipation out of the
device. The thermal heat sink should be soldered to the board as described in the
PowerPad Package
section.
The PowerPAD package is designed so that the leadframe die pad (or thermal pad) is exposed on the bottom of
the IC. This provides an extremely low thermal resistance path between the die and the exterior of the package.
The thermal pad on the bottom of the IC can then be soldered directly to the printed circuit board (PCB), using
the PCB as a heatsink.
For more detailed information regarding the PowerPAD package and its thermal properties, see either the
SLMA004
Application Brief
PowerPAD Made Easy
or the
SLMA002
Technical Brief
PowerPAD Thermally
Enhanced Package
.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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| ADS5444-EP | 制造商:TI 制造商全稱:Texas Instruments 功能描述:13-BIT 250-MSPS ANALOG-TO-DIGITAL CONVERTER |
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| ADS5444EVM-CVAL | 制造商:Texas Instruments 功能描述:ADS5444EVM-CVAL - Boxed Product (Development Kits) |
| ADS5444HFGMPR | 制造商:Texas Instruments 功能描述:EVAL UNIT FOR ADS5444-SP - Bulk |
| ADS5444IPFP | 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 13 BIT 250MSPS ADC RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32 |
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