參數(shù)資料
型號: ADS5444_07
廠商: Texas Instruments, Inc.
英文描述: 13-BIT 250 MSPS ANALOG-TO-DIGITAL CONVERTER
中文描述: 13位250 MSPS的模擬數(shù)字轉(zhuǎn)換器
文件頁數(shù): 2/27頁
文件大?。?/td> 1031K
代理商: ADS5444_07
www.ti.com
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
THERMAL CHARACTERISTICS
(1)
ADS5444
SLWS162A–AUGUST 2005–REVISED FEBRUARY 2006
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGING/ORDERING INFORMATION
(1)
Product
Package-
Lead
Package
Designator
(1)
Specified
Temperature
Range
Package
Marking
Ordering
Number
Transport
Media,
Quantity
Tray, 96
ADS5444IPFP
ADS5444IPFPR
HTQFP-80
(2)
PowerPAD
ADS5444
PFP
–40°C to 85°C
ADS5444IPFP
Tape and Reel, 1000
(1)
For the most current product and ordering information, see the Package Option Addendum located at the end of this document, or see
the TI website at
www.ti.com
.
Thermal pad size: 7,5 mm x 7,5 mm (typ)
(2)
VALUE / UNIT
6 V
5 V
–0.3 V to AV
DD
+0.3 V
–0.3 V to AV
DD
+0.3 V
±2.5 V
–0.3 V to DRV
DD
+0.3 V
–40°C to 85°C
150°C
–65°C to 150°C
2.5 kV
AV
DD
to GND
DRV
DD
to GND
Supply voltage
Analog input to GND
Clock input to GND
CLK to CLK
Digital data output to GND
Operating temperature range
Maximum junction temperature
Storage temperature range
ESD Human Body Model (HBM)
(1)
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only and functional operation of the device at these or any other conditions beyond
those specified is not implied.
PARAMETER
TEST CONDITIONS
TYP
21.7
15.4
50
43.4
2.99
UNIT
°C/W
°C/W
°C/W
°C/W
°C/W
Soldered slug, no airflow
Soldered slug, 250-LFPM airflow
Unsoldered slug, no airflow
Unsoldered slug, 250-LFPM airflow
Bottom of package (heatslug)
θ
JA
θ
JC
(1)
Using 36 thermal vias (6 x 6 array). See the Application Section.
2
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