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參數(shù)資料
| 型號： | ADP2140ACPZ3328R7 |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 28/32頁 |
| 文件大?。?/td> | 2731K |
| 描述： | IC REG DL BCK/LINEAR 10LFCSP |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 拓撲： | 降壓（降壓）同步（1），線性（LDO）（1） |
| 功能： | 任何功能 |
| 輸出數(shù)： | 2 |
| 頻率 - 開關(guān)： | 3MHz |
| 電壓/電流 - 輸出 1： | 3.3V，600mA |
| 電壓/電流 - 輸出 2： | 2.8V，300mA |
| 帶 LED 驅(qū)動器： | 無 |
| 帶監(jiān)控器： | 無 |
| 帶序列發(fā)生器： | 是 |
| 電源電壓： | 1.65 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 10-WFDFN 裸露焊盤，CSP |
| 供應(yīng)商設(shè)備封裝： | 10-LFCSP-WD（3x3） |
| 包裝： | 標(biāo)準(zhǔn)包裝 |
| 其它名稱： | ADP2140ACPZ3328R7DKR |
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ADP2140
Data Sheet
Rev. A | Page 28 of 32
THERMAL CONSIDERATIONS
In most applications, the ADP2140 does not dissipate much
heat due to its high efficiency. However, in applications with
high ambient temperature and high supply voltage-to-output
voltage differential, the heat dissipated in the package is large
enough that it can cause the junction temperature of the die to
exceed the maximum junction temperature of 125癈.
When the junction temperature exceeds 150癈, the converter
enters thermal shutdown. It recovers only after the junction
temperature has decreased below 130癈 to prevent any permanent
damage. Therefore, thermal analysis for the chosen application
is very important to guarantee reliable performance over all
conditions. The junction temperature of the die is the sum of
the ambient temperature of the environment and the tempera-
ture rise of the package due to the power dissipation, as shown
in Equation 2.
To guarantee reliable operation, the junction temperature of the
ADP2140 must not exceed 125癈. To ensure the junction temper-
ature stays below this maximum value, the user needs to be aware
of the parameters that contribute to junction temperature changes.
These parameters include ambient temperature, power dissipa-
tion in the power device, and thermal resistances between the
junction and ambient air (?/DIV>
JA
). The ?/DIV>
JA
number is dependent on
the package assembly compounds that are used and the amount of
copper used to solder the package GND pins to the PCB. Table 10
shows typical ?/DIV>
JA
values of the 10-lead, 3 mm ?3 mm LFCSP for
various PCB copper sizes.
Table 10. Typical ?/DIV>
JA
Values
Copper Size (mm
2
)
?nbsp (癈/W)
0
1
42.5
50
40.0
100
38.8
300
37.2
500
36.2
1
The device is soldered to minimum size pin traces.
The junction temperature of the ADP2140 can be calculated
from the following equation:
T
J
= T
A
+ (P
D
??/DIV>
JA
)
(2)
where:
T
A
is the ambient temperature.
P
D
is the total power dissipation in the die, given by
P
D
= P
LDO
+ P
BUCK
where:
P
LDO
= [(V
IN
V
OUT
) ?I
LOAD
] + (V
IN
?I
AGND
)
(3)
P
BUCK
= P
SW
+ P
TRAN
+ P
SW_COND
(4)
where:
I
LOAD
is the LDO load current.
I
AGND
is the analog ground current.
V
IN
and V
OUT
are the LDO input and output voltages,
respectively.
P
SW
, P
TRAN
, and P
SW_COND
are defined in the Efficiency section.
For a given ambient temperature and total power dissipation,
there exists a minimum copper size requirement for the PCB to
ensure the junction temperature does not rise above 125癈. The
following figures show junction temperature calculations for
different ambient temperatures, total power dissipation, and
areas of PCB copper.
145
135
125
115
105
95
85
75
65
55
45
35
25
0 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 2.75 3.00
TOTAL POWER DISSIPATION W
500mm
2
50mm
2
0mm
2
T
J MAX
Figure 91. Junction Temperature vs. Power Dissipation, T
A
= 25癈
140
130
120
110
100
90
80
70
60
50
0
0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50
TOTAL POWER DISSIPATION W
500mm
2
50mm
2
0mm
2
T
J MAX
Figure 92. Junction Temperature vs. Power Dissipation, T
A
= 50癈
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