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參數(shù)資料
| 型號(hào)： | AD9643BCPZ-210 |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | ADC |
| 英文描述： | 2-CH 14-BIT FLASH METHOD ADC, PARALLEL ACCESS, QCC64 |
| 封裝： | 9 X 9 MM, ROHS COMPLIANT, MO-220VMMD-4, LFCSP-64 |
| 文件頁數(shù)： | 3/36頁 |
| 文件大?。?/td> | 1659K |
| 代理商： | AD9643BCPZ-210 |
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AD9643
Rev. A | Page 11 of 36
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Rating
Electrical
AVDD to AGND
0.3 V to +2.0 V
DRVDD to AGND
0.3 V to +2.0 V
VIN+A/VIN+B, VINA/VINB to AGND
0.3 V to AVDD + 0.2 V
CLK+, CLK to AGND
0.3 V to AVDD + 0.2 V
SYNC to AGND
0.3 V to AVDD + 0.2 V
VCM to AGND
0.3 V to AVDD + 0.2 V
CSB to AGND
0.3 V to DRVDD + 0.3 V
SCLK to AGND
0.3 V to DRVDD + 0.3 V
SDIO to AGND
0.3 V to DRVDD + 0.3 V
OEB to AGND
0.3 V to DRVDD + 0.3 V
PDWN to AGND
0.3 V to DRVDD + 0.3 V
OR+/OR to AGND
0.3 V to DRVDD + 0.3 V
D0/D0+ Through D13/D13+
to AGND
0.3 V to DRVDD + 0.3 V
DCO+/DCO to AGND
0.3 V to DRVDD + 0.3 V
Environmental
Operating Temperature Range
(Ambient)
40°C to +85°C
Maximum Junction Temperature
Under Bias
150°C
Storage Temperature Range
(Ambient)
65°C to +125°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
The exposed paddle must be soldered to the ground plane for
the LFCSP package. This increases the reliability of the solder
joints, maximizing the thermal capability of the package.
Table 7. Thermal Resistance
Package Type
Airflow
Velocity
(m/sec)
Unit
0
26.8
1.14
10.4
°C/W
1.0
21.6
°C/W
64-Lead LFCSP
9 mm × 9 mm
(CP-64-4)
2.0
20.2
°C/W
1 Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.
2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3 Per MIL-Std 883, Method 1012.1.
4 Per JEDEC JESD51-8 (still air).
Typical θJA is specified for a 4-layer PCB with a solid ground
plane. As shown in Table 7, airflow increases heat dissipation,
which reduces θJA. In addition, metal in direct contact with the
package leads from metal traces, through holes, ground, and
power planes, reduces the θJA.
ESD CAUTION
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