參數(shù)資料
型號(hào)： AD9430BSVZ-170
廠商： Analog Devices Inc
文件頁(yè)數(shù)： 2/44頁(yè)
文件大小： 0K
描述： IC ADC 12BIT 170MSPS 3.3V100TQFP
標(biāo)準(zhǔn)包裝： 1
位數(shù)： 12
采樣率（每秒）： 170M
數(shù)據(jù)接口： 并聯(lián)
轉(zhuǎn)換器數(shù)目： 1
功率耗散（最大）： 1.43mW
電壓電源： 單電源
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 100-TQFP 裸露焊盤
供應(yīng)商設(shè)備封裝： 100-TQFP-EP（14x14）
包裝： 托盤
輸入數(shù)目和類型： 1 個(gè)差分，單極
AD9430
Rev. E | Page 10 of 44
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Rating
AVDD, DRVDD
4 V
Analog Inputs
0.5 V to AVDD + 0.5 V
Digital Inputs
0.5 V to DRVDD + 0.5 V
REFIN Inputs
–0.5 V to AVDD + 0.5 V
Digital Output Current
20 mA
Operating Temperature Range
40°C to +85°C
Storage Temperature Range
65°C to +150°C
Maximum Junction Temperature
150°C
Maximum Case Temperature
150°C
θJA1
25°C/W, 32°C/W
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational section
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
EXPLANATION OF TEST LEVELS
Table 6.
Level
Description
I
100% production tested.
II
100% production tested at 25°C and sample tested at
specified temperatures.
III
Sample tested only.
IV
Parameter is guaranteed by design and
characterization testing.
V
Parameter is a typical value only.
VI
100% production tested at 25°C; guaranteed by
design and characterization testing for industrial
temperature range; 100% production tested at
temperature extremes for military devices.
1 Typical θJA = 32°C/W (heat slug not soldered); typical θJA = 25°C/W (heat slug
soldered) for multilayer board in still air with solid ground plane.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
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