- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄1893 > AD9267BCPZ (Analog Devices Inc)IC MOD SIGMA-DELTA DUAL 64LFCSP PDF資料下載
參數(shù)資料
| 型號： | AD9267BCPZ |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 22/24頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MOD SIGMA-DELTA DUAL 64LFCSP |
| 標準包裝： | 1 |
| 類型： | 三角積分調(diào)制器 |
| 應(yīng)用： | 無線通信系統(tǒng) |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 64-VFQFN 裸露焊盤，CSP |
| 供應(yīng)商設(shè)備封裝： | 64-LFCSP-VQ（9x9） |
| 包裝： | 托盤 |
AD9267
Rev. 0 | Page 7 of 24
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Rating
Electrical
AVDD to AGND
0.3 V to +2.0 V
DVDD to DGND
0.3 V to +2.0 V
DRVDD to DGND
0.3 V to +3.9 V
AGND to DGND
0.3 V to +0.3 V
AVDD to DRVDD
3.9 V to +2.0 V
CVDD to CGND
0.3 V to +2.0 V
CGND to DGND
0.3 V to +0.3 V
D0±A to D3±A to DGND
0.3 V to +2.0 V
D0±B to D3±B to DGND
0.3 V to +2.0 V
DCO± to DGND
0.3 V to +2.0 V
OR±A, OR±B to DGND
0.3 V to +2.0 V
PDWNA to DGND
0.3 V to +3.9 V
PDWNB to DGND
0.3 V to +3.9 V
PLLMULTx to DGND
0.3 V to +3.9 V
SDIO to DGND
0.3 V to +3.9 V
CSB to AGND
0.3 V to +3.9 V
SCLK to AGND
0.3 V to +3.9 V
VIN±A, VIN±B to AGND
0.3 V to +2.5 V
CLK+, CLK to CGND
0.3 V to +2.0 V
Environmental
Storage Temperature Range
65°C to +125°C
Operating Temperature Range
40°C to +85°C
Lead Temperature (Soldering, 10 sec)
300°C
Junction Temperature
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the PCB
increases the reliability of the solder joints, maximizing the
thermal capability of the package.
Typical θJA and θJC are specified for a 4-layer board in still air.
Airflow increases heat dissipation, effectively reducing θJA. In
addition, metal in direct contact with the package leads from
metal traces, through holes, ground, and power planes reduces
the θJA.
Table 6. Thermal Resistance
Package Type
θJA
Unit
64-Lead LFCSP (CP-64-4)
22
°C/W
ESD CAUTION
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AD9272BSVZRL-80 | IC ADC ASD OCTAL 80MSPS 100-TQFP |
| AD9273BBCZ-50 | IC ADCASD OCTAL 25MSPS 144CSPBGA |
| AD9276BSVZ | IC ADC 12BIT LNA/VGA/AAF 100TQFP |
| AD9277BSVZ | IC ADC 14BIT LNA/VGA/AAF 100TQFP |
| AD9278BBCZ | IC ADC 12BIT 50MSPS 144CSPBGA |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AD9267BCPZRL7 | 功能描述:IC MOD SIGMA-DELTA DUAL 64LFCSP RoHS:是 類別:集成電路 (IC) >> 專用 IC 系列:- 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:1 系列:- 類型:調(diào)幀器 應(yīng)用:數(shù)據(jù)傳輸 安裝類型:表面貼裝 封裝/外殼:400-BBGA 供應(yīng)商設(shè)備封裝:400-PBGA（27x27） 包裝:散裝 |
| AD9267EBZ | 功能描述:BOARD EVALUATION FOR AD9267 RoHS:是 類別:編程器，開發(fā)系統(tǒng) >> 評估板 - 模數(shù)轉(zhuǎn)換器 (ADC) 系列:- 產(chǎn)品培訓模塊:Obsolescence Mitigation Program 標準包裝:1 系列:- ADC 的數(shù)量:1 位數(shù):12 采樣率（每秒）:94.4k 數(shù)據(jù)接口:USB 輸入范圍:±VREF/2 在以下條件下的電源（標準）:- 工作溫度:-40°C ~ 85°C 已用 IC / 零件:MAX11645 已供物品:板，軟件 |
| AD9268 | 制造商:AD 制造商全稱:Analog Devices 功能描述:16-Bit, 80 MSPS/105 MSPS/125 MSPS, 1.8 V Dual Analog-to-Digital Converter (ADC) |
| AD9268-105EBZ1 | 制造商:AD 制造商全稱:Analog Devices 功能描述:16-Bit, 80 MSPS/105 MSPS/125 MSPS, 1.8 V Dual Analog-to-Digital Converter (ADC) |
| AD9268-125EBZ | 功能描述:數(shù)據(jù)轉(zhuǎn)換 IC 開發(fā)工具 Dual 16 bit 125 high SNR ADC RoHS:否 制造商:Texas Instruments 產(chǎn)品:Demonstration Kits 類型:ADC 工具用于評估:ADS130E08 接口類型:SPI 工作電源電壓:- 6 V to + 6 V |
發(fā)布緊急采購，3分鐘左右您將得到回復。