參數(shù)資料
型號(hào): AD8352ACPZ-R7
廠商: Analog Devices Inc
文件頁數(shù): 11/20頁
文件大小: 0K
描述: IC AMP RF/IF DIFF 2GHZ 16-LFCSP
產(chǎn)品培訓(xùn)模塊: Differential Circuit Design Techniques for Communication Applications
設(shè)計(jì)資源: Using AD8352 as an Ultralow Distortion Differential RF/IF Front End for High Speed ADCs (CN0046)
標(biāo)準(zhǔn)包裝: 1
放大器類型: RF/IF 差分
電路數(shù): 1
輸出類型: 差分
轉(zhuǎn)換速率: 8000 V/µs
-3db帶寬: 2.2GHz
電流 - 輸入偏壓: 75nA
電流 - 電源: 37mA
電壓 - 電源,單路/雙路(±): 3 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 16-VQFN 裸露焊盤,CSP
供應(yīng)商設(shè)備封裝: 16-LFCSP-VQ
包裝: 標(biāo)準(zhǔn)包裝
產(chǎn)品目錄頁面: 550 (CN2011-ZH PDF)
其它名稱: AD8352ACPZ-R7DKR
AD8352
Rev. B | Page 19 of 20
OUTLINE DIMENSIONS
1
0.50
BSC
0.60 MAX
PIN 1
INDICATOR
1.50 REF
0.50
0.40
0.30
0.25 MIN
0.45
2.75
BSC SQ
TOP
VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
PIN 1
INDICATOR
0.90
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
3.00
BSC SQ
*1.65
1.50 SQ
1.35
16
5
13
8
9
12
4
EXPOSED
PAD
(BOTTOM VIEW)
*COMPLIANT TO JEDEC STANDARDS MO-220-VEED-2
EXCEPT FOR EXPOSED PAD DIMENSION.
Figure 41. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
3 mm × 3 mm Body, Very Thin Quad
(CP-16-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range
Package Description
Ordering
Quantity
Package
Option
Branding
AD8352ACPZ-WP1
40°C to +85°C
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ],
Waffle Pack
50
CP-16-3
Q0R
AD8352ACPZ-R71
40°C to +85°C
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ],
7”Tape and Reel
3000
CP-16-3
Q0R
AD8352ACPZ-R21
40°C to +85°C
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ],
7”Tape and Reel
250
CP-16-3
Q0R
AD8352-EVALZ1
Evaluation Board
1 Z = RoHS Compliant Part.
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