
AD7723
–22–
REV. 0
GROUNDING AND LAYOUT
The analog and digital power supplies to the AD7723 are inde-
pendent and separately pinned out to minimize coupling be-
tween analog and digital sections within the device. All the
AD7723 AGND and DGND pins should be soldered directly to
a ground plane to minimize series inductance. In addition, the
ac path from any supply pin or reference pin (REF1 and REF2)
through its decoupling capacitors to its associated ground must be
made as short as possible (Figure 44). To achieve the best decou-
pling, place surface mount capacitors as close as possible to the
device, ideally right up against the device pins.
All ground planes must not overlap to avoid capacitive coupling.
The AD7723’s digital and analog ground planes must be con-
nected at one place by a low inductance path, preferably right
under the device. Typically, this connection will either be a
trace on the Printed Circuit Board of 0.5 cm wide when the
ground planes are on the same layer, or 0.5 cm wide minimum
plated through holes when the ground planes are on different
layers. Any external logic connected to the AD7723 should use
a ground plane separate from the AD7723’s digital ground
plane. These two digital ground planes should also be con-
nected at just one place.
Separate power supplies for AV
DD
and DV
DD
are also highly
desirable. The digital supply pin DV
DD
should be powered from
a separate analog supply, but if necessary DV
DD
may share its
power connection to AV
DD
. Refer to the connection diagram
(Figure 44). The ferrites are also recommended to filter high
frequency signals from corrupting the analog power supply.
A minimum etch technique is generally best for ground planes
as it gives the best shielding. Noise can be minimized by paying
attention to the system layout and preventing different signals
from interfering with each other. High level analog signals
should be separated from low level analog signals, and both
should be kept away from digital signals. In waveform sampling
and reconstruction systems the sampling clock (CLKIN) is as
vulnerable to noise as any analog signal. CLKIN should be
isolated from the analog and digital systems. Fast switching
signals like clocks should be shielded with their associated
ground to avoid radiating noise to other sections of the board,
and clock signals should never be routed near the analog inputs.
Avoid running digital lines under the device as these will couple
noise onto the die. The analog ground plane should be allowed
to run under the AD7723 to shield it from noise coupling. The
power supply lines to the AD7723 should use as large a trace as
possible (preferably a plane) to provide a low impedance path
and reduce the effects of glitches on the power supply line.
Avoid crossover of digital and analog signals. Traces on opposite
sides of the board should run at right angles to each other. This
will reduce the effects of feedthrough through the board.
+5V
10
m
F
100nF
100nF
100nF
10nF
10nF
10nF
10nF
10nF
10
m
F
220nF
10nF
1
m
F
REF2
AGND2
REF1
AV
DD
1
AGND1
AGND1
AGND
AGND
AV
DD
AV
DD
DV
DD
DGND
DGND
AD7723 ANALOG
GROUND PLANE
AD7723 DIGITAL
GROUND PLANE
Figure 44. Reference and Power Supply Decoupling