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AD5762R
Data Sheet
Rev. C | Page 10 of 32
ABSOLUTE MAXIMUM RATINGS
TA = 25°C unless, otherwise noted. Transient currents of up to
100 mA do not cause SCR latch-up.
Table 4.
Parameter
Rating
AVDD to AGND, DGND
0.3 V to +17 V
AVSS to AGND, DGND
+0.3 V to 17 V
DVCC to DGND
0.3 V to +7 V
Digital Inputs to DGND
0.3 V to (DVCC + 0.3 V) or +7 V,
whichever is less
Digital Outputs to DGND
0.3 V to DVCC + 0.3 V
REFx to AGND, PGND
0.3 V to AVDD + 0.3 V
REFOUT to AGND
AVSS to AVDD
TEMP
AVSS to AVDD
VOUTx to AGND
AVSS to AVDD
AGND to DGND
0.3 V to +0.3 V
Operating Temperature Range
Industrial
40°C to +85°C
Storage Temperature Range
65°C to +150°C
Junction Temperature (TJ max)
150°C
Lead Temperature (Soldering)
JEDEC Industry Standard
J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 5. Thermal Resistance
Package Type
θJA
θJC
Unit
32-Lead TQFP
65
12
°C/W
ESD CAUTION